Aries Electronics now offers its 27 mm CSP (chip scale package)/MicroBGA (ball grid array) test and burn-in sockets with an optional adjustable pressure pad. With only a 0,254 mm displacement per revolution of the screw, this mechanism makes the sockets ideal for testing very small, fragile devices, such as thin or ceramic chips, without causing damage, and devices with large height tolerances.
Users can back off the adjusting screw and close the socket’s lid securely with one finger and very little force, and then modify the pressure pad force with the adjusting screw after the lid is closed to ensure good contact. The screw can also be adjusted based on device height from chip to chip, eliminating socket rework downtime to design a new pressure pad.
Each adjustable pressure pad comes with an easily modified, user-adjustable washer stack in 0,0265 mm and 0,254 mm increments that serves as a hard stop to eliminate device over-compression. If constant large device height changes are expected during testing, the washer stack can be removed without affecting the socket’s performance.
The Aries CSP/MicroBGA test and burn-in socket family accommodates a variety of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash devices from 6,5 to 55 mm² by using machined or custom moulded pressure pads and interposers.
With a signal path of only 1,96 mm, the new sockets provide minimal signal loss for higher bandwidth capability. The sockets’ relatively low cost and small overall size allow a high number of sockets per BIB (burn-in board) and BIBs per oven, while remaining operator friendly.
Aries’ latest sockets use solderless pressure mount compression spring probes accurately located by two moulded plastic alignment pins and mounted with stainless steel screws, making it easy to mount and remove them from the test board. The compression spring probes leave minimal witness marks on the bottom surface of the device pads for increased reliability.
Contact forces are 15 g per contact on a 0,30 to 0,35 mm pitch; 16 g per contact on a 0,40 to 0,45 mm pitch and 25 g per contact on pitches of 0,50 mm or larger. Operating temperature is -55°C to +150°C and estimated contact life is a minimum of 500 000 cycles.
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