Diamond Systems has developed a new PC/104 form factor single board computer, the Helios, offering mid- to high-end computing power in a compact, low-power and low-cost PC/104 single board computer (SBC).
Ruggedised and operating fan-less over the temperature range of -40°C to +85°C, Helios is a suitable choice for embedded applications operating in harsh environments.
Helios combines a low-power, highly integrated x86-based CPU with Diamond Systems’ high-accuracy auto-calibrating data acquisition circuitry on a single PC/104 board. The SBC utilises the DMP Vortex86SX/DX single chip processors operating at up to 800 MHz and has up to 256 MB of RAM soldered onboard. It offers standard PC peripheral features, including four USB 2.0 ports, one 10/100Base-T Ethernet interface, four RS232 ports (two with RS232/422/485 capability), an IDE interface and VGA/LCD graphics.
Helios’ optional onboard data acquisition circuitry includes sixteen 16-bit analog inputs, four 12-bit analog outputs, up to 40 digital I/O lines, a 512-sample FIFO, and two counter/timers. The analog I/O circuit includes auto-calibration circuitry, which ensures accurate analog I/O performance to within ±2 LSB over the entire temperature range.
Helios is rugged, featuring 256 MB of soldered DRAM, fanless operation, and power consumption under 5 W. Optional hardwired jumpers and latching connectors are available for increased resistance to shock and vibration.
Microsoft Windows IoT on ARM Altron Arrow
Computer/Embedded Technology
This expansion means that the Windows IoT ecosystem can now harness the power of ARM processors, known for their energy efficiency and versatility.
Read more...Hardened-grade network switches CST Electronics
Computer/Embedded Technology
Lantronix’s hardened switches provide Layer 2 or Layer 3 networking, and are available as Power-over-Ethernet (PoE) or Power-over-Ethernet Plus (PoE+).
Read more...Ryzen V3000 computer on module Altron Arrow
Computer/Embedded Technology
SolidRun has recently announced the launch of its new Ryzen V3000 CX7 Com module, configurable with the eight-core/16-thread Ryzen Embedded V3C48 processor.
Read more...1.6T Ethernet IP solution to drive AI and hyperscale data centre chips
Computer/Embedded Technology
As artificial intelligence (AI) workloads continue to grow exponentially, and hyperscale data centres become the backbone of our digital infrastructure, the need for faster and more efficient communication technologies becomes imperative. 1.6T Ethernet will rapidly be replacing 400G and 800G Ethernet as the backbone of hyperscale data centres.
Read more...Maximising edge computing
Computer/Embedded Technology
Senao Networks has announced its launch of its SX904 SmartNIC based on the Intel NetSec Accelerator Reference Design.
Read more...UFS Ver. 4.0 embedded Flash memory devices EBV Electrolink
Computer/Embedded Technology
KIOXIA Europe has announced sampling of the industry’s first Universal Flash Storage (UFS) version 4.0 embedded Flash memory devices designed for automotive applications.
Read more...Powering factory automation into the future Rugged Interconnect Technologies
Computer/Embedded Technology
Powered by the newest 13th Gen Intel processors, ADLINK Technology’s COM-HPC-cRLS module is a future-proof edge AI solution.
Read more...Linux OS with immutable file system
Computer/Embedded Technology
What really sets VanillaOS apart from others, however, is in security, where it takes a new approach to computing by using an immutable file system for improved security and stability.
printer friendly version