Aries Electronics has launched a new series of adapters that enable the use of virtually any SMT IC device on a pitch of 0,4 mm or higher to PC boards on 0,5 mm pitch. These are ideally suited to adapting an IC device to some of the more popular TSSOP and QFP packages on 0,5 mm pitch. The fine pitch bump adapters, an expansion to Aries’ line of Correct-A-Chip adapters, can save designers time and money by eliminating the need for engineering rework.
This adapter enables the user to solder a BGA or other SMT device to pads on the component side of the adapter, which will then connect through the adapter to the 0,5 mm pitch raised connection pads on the bottom. The connection scheme comes standard in a pin 1-to-pin 1 routing, but can be customised to accommodate virtually any connection requirement.
The adapter boards are fabricated from 0,032” thick FR4 or Rogers 370 HR, with ½ ounce copper traces on both sides. The NSMD pads are finished with ENIG. The adapters operate at up to 105°C for FR4 versions and 130°C for the lead-free version.
Fine pitch bump adapters are available in a panelised form for easy pick-and-place assembly of the new device, as an adapter only, or as a complete, turn-key solution with devices mounted. In addition to standard products, special materials, platings, sizes and configurations can be furnished depending on quantity.
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