The semi-flattened oval shape of the new TTMS-MP cable marker sleeves from Tyco Electronics makes it fast and easy to slip onto cables. Designed for computer-based printing using a T2000CT printer, the heat-shrink marker sleeves are supplied in large packs – typically 50 or 100 metres – to minimise spool changes during a print run. The product format makes TTMS-MP identification tubing suitable for applications where in-sequence kitting is not of overriding importance, for example where several hundred identical markers are required.
The marker sleeves are made from durable, flame-retardant, and radiation-cross-linked heat shrinkable polyolefin, with an operating temperature range of -55°C to +135°C. Available in sizes ranging from 2,4 mm to 50,8 mm, most sizes offer a 3:1 shrink ratio. Meeting the mark permanence requirements of SAE AS81531 and MIL-STD-202 both before and after shrinking, marks are permanent immediately upon printing and remain legible even when exposed to abrasion, aggressive cleaning solvents, and military fuels and oils.
Designing with PCIe Spectrum Concepts
Editor's Choice Interconnection
PCI Express has become the backbone of modern high-performance systems with each new generation promising higher bandwidth, but that performance comes with a cost.
Read more...Connectivity solutions for hydrogen technologies Hiconnex
Interconnection
As the production distribution and utilisation of hydrogen continue to scale, connectivity becomes a key enabler for efficient energy transmission, data communication, and system control.
Read more...Robust single-pole power connectivity Hiconnex
Interconnection
Designed for cable-to-cable and cable-to-equipment use, Radiall’s single-pole power connector support current ratings from 250 A to 750 A and operating voltages up to 1000 V AC or DC.
Read more...M12 push-pull connectors IOT Electronics
Interconnection
Phoenix Contact’s M12 push-pull connectors with internal locking set a new benchmark for fast, secure, and space-saving connectivity in industrial automation.
Read more...Versatile outdoor waterproof connectors Vepac Electronics
Interconnection
The LP-20 outdoor waterproof connector series offers a versatile range of rugged, circular connectors with 2, 3, 4, 5, 7, 8, 9, 12 and 14-pin configurations.
Read more...Next generation HMI processing platform Future Electronics
DSP, Micros & Memory
Microchip’s latest hybrid MCU SiP integrates an Arm926EJ-S processor with 512 Mb of DDR2 SDRAM and is engineered to meet the rising demand for sophisticated HMI solutions in modern vehicles.
Read more...Comprehensive range of data connectors IOT Electronics
Interconnection
Phoenix Contact’s comprehensive range of data connectors provides reliable connection solutions for modern networked applications across industrial, infrastructure, and commercial environments.
Read more...Compact inline connector for aerospace Hiconnex
Interconnection
Radiall’s Small Inline Connector series is a fully qualified wire-to-wire solution designed to simplify harness creation, installation, and modification in aerospace applications.
Read more...Compact hybrid power storage connector IOT Electronics
Interconnection
Phoenix Contact has introduced a new hybrid connector for electrical energy storage systems, designed to combine power, signal, and data transmission in a single, compact interface.
Read more...MIL-spec connector series Future Electronics
Interconnection
The MIL-HD2 connector series from Amphenol is the company’s next-generation, SOSA-aligned solution engineered to meet the most demanding requirements of modern military embedded systems.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version