Enclosures, Racks, Cabinets & Panel Products


MicroTCA housing system

2 September 2009 Enclosures, Racks, Cabinets & Panel Products

New from Schroff is a compact MicroTCA system that can accommodate up to six single mid-size AdvancedMC modules in a 19-inch enclosure with a height of only 1U. Featuring a special case design that ensures efficient cooling of the modules, the MicroTCA system is suitable for use in high-performance multiprocessor systems where rack space may be limited, for example in industrial or transportation applications.

The system provides six slots for horizontal mounting of the AdvancedMC modules, as well as a dedicated slot for a MicroTCA carrier hub (MCH). In addition, it is equipped with a special MicroTCA backplane, a built-in power supply and a hot-swap-capable fan tray.

The topology of the MicroTCA backplane has been designed to allow simultaneous use of four different software protocols: GbE, 10GbE, PCIe and Serial Rapid I/O. All AdvancedMC slots are fully compatible with PICMG AMC.0 R2.0, the Advanced Mezzanine Card base specification.

With a depth of 350 mm, the 1U system includes a 250 W AC power supply unit behind the backplane, with a MicroTCA-compatible power management module in the form of a mezzanine board mounted on the rear of the backplane. Efficient cooling is achieved by the temperature-controlled fan tray, combined with the triangular design of the side vents, which increases the effective air inlet and exhaust volumes by some 30%. The result is a cooling capacity of 30 W per AdvancedMC module and 40 W for the MCH, with a maximum temperature rise inside the chassis of only 12,5°C.



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