Telecoms, Datacoms, Wireless, IoT


Wideband LNA for embedded antennas

16 September 2009 Telecoms, Datacoms, Wireless, IoT

Infineon’s BGB 707L7ESD is a wideband, general-purpose silicon-germanium carbon (SiGe:C) MMIC LNA (low noise amplifier) with integrated ESD protection and active biasing in a very small TSLP-7-1 package. The device is as flexible as a discrete transistor and offers numerous integrated features for compact designs. Integrated ESD protection of 4 kV at RF input, a maximum device transition frequency of 45 GHz, a high input gain compression point (-8 dBm) and excellent noise figure (1 dB at 6 GHz) make it a suitable choice for a broad range of RF circuit designs. Circuit designers can also take advantage of the flexibility and stability of an integrated power-off function for longer battery life, active biasing, a wide operating voltage range and current adjustable between 3 and 30 mA.

EBV Electrolink, +27 (0)21 402 1940, [email protected], www.ebv.com

Electrocomp, +27 (0)11 458 9000, [email protected], www.electrocomp.co.za



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

First NVMe SSD Built with 8th-gen BiCS FLASH
EBV Electrolink Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.

Read more...
IMU with dual-sensing capability
EBV Electrolink Analogue, Mixed Signal, LSI
ST’s 6-axis inertial measurement unit integrates a dual accelerometer up to 320g and embedded AI for activity tracking and high-impact sensing.

Read more...
Industrial Ethernet time sensitive networking switch
RS South Africa Telecoms, Datacoms, Wireless, IoT
The ADIN3310 and ADIN6310 are 3-port and 6-port Gigabit Ethernet time sensitive networking (TSN) switches with integrated security primarily designed for industrial Ethernet applications.

Read more...
When it comes to long-term reliability of RF amplifier ICs, focus first on die junction temperature
Altron Arrow Editor's Choice Telecoms, Datacoms, Wireless, IoT
When considering the long-term reliability of integrated circuits, a common misconception is that high package or die thermal resistance is problematic. However, high or low thermal resistance, by itself, tells an incomplete story.

Read more...
Automotive-grade digital isolators
Telecoms, Datacoms, Wireless, IoT
The NSI83xx series of capacitive-based isolators from NOVOSENSE Microelectronics offer superior EOS resilience and minimal power noise susceptibility.

Read more...
Why bis means business for LTE Cat 1 IoT connections
NuVision Electronics Editor's Choice Telecoms, Datacoms, Wireless, IoT
Tomaž Petaros, product manager IoT EMEA at Quectel Wireless Solutions explains why the market for Cat 1bis IoT connections is getting busy.

Read more...
Wi-Fi in 2025: When is Wi-Fi 7 the answer?
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Wi-Fi 7 introduces multi-link operation and lower latency, a game-changing feature that allows devices to transmit and receive data across multiple frequency bands simultaneously to significantly reduce network congestion.

Read more...
Bluetooth Lite SoCs purpose built for IoT
NuVision Electronics Telecoms, Datacoms, Wireless, IoT
Whether it is enabling predictive maintenance on industrial equipment, tracking assets in dense environments, or running for years on a coin cell battery in ultra-low power sensors, developers need solutions that are lean, reliable, and ready to scale with emerging use cases.

Read more...
LTE Cat 1bis module
Otto Wireless Solutions Telecoms, Datacoms, Wireless, IoT
The A7673X LTE Cat 1bis module from SimCom is engineered to meet the growing demands of the IoT industry, offering exceptional performance and seamless integration.

Read more...
Track with precision
Electrocomp Telecoms, Datacoms, Wireless, IoT
KYOCERA AVX provides innovative antennas for cellular, LTE-M, NB-IoT, LoRa, GNSS, BLE, UWB, Wi-Fi, and future Satellite IoT.

Read more...