Infineon’s new XWAY WAVE100 family of single-chip WLAN ICs provide a solution for wireless network access points that are compliant to the 802.11n draft standard for data rates up to 150 Mbps, as well as the 802.11 b/g standard.
The parts are fully compliant to the European Union Code of Conduct (CoC) for broadband equipment energy efficiency.
The single-chip XWAY WAVE100 family integrates WLAN baseband, media access controller (MAC), RF, low noise amplifier (LNA) and power amplifier (PA) functionalities. Systems based on the chips require very few external components and need no external memory.
In the manufacturing of WLAN equipment, production throughput largely depends on the trimming of the WLAN device to achieve optimum performance. Trimming adjusts for the characteristics of analog components which vary with the silicon process, temperature and lifetime. With the XWAY WAVE100 family, Infineon provides an integrated toolbox to support on-the-fly trimming with temperature, voltage and supply monitoring during standard operation mode.
The devices are available with either SDIO or PCI interface. When used in combination with the XWAY AMAZON-SE and XWAY ARX182 ADSL2+ single-chips for low-cost xDSL WLAN router and gateway respectively, the SDIO variant frees up the USB 2.0 host interface of the xDSL single-chips for other tasks such as connecting a hard disk, printer or 3G dongle. The PCI variant can be used in combination with the XWAY ARX100 family for full-featured WLAN gateways.
The XWAY WAVE100 family features advanced power management modes to reduce power consumption, including sleep and several power-down states. This solution achieves RF performance with sensitivity of -90,5 dBm at 11 Mbps (802.11b), -76,5dBm at 54 Mbps (802.11g) and -73,5 dBm at 150 Mbps (802.11n 1x1). Antenna diversity is supported to further improve receiver sensitivity. The chips use only a single 3,3 V supply, operate at 2,4 GHz and support both 20 MHz and 40 MHz bandwidths.
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