Convection reflow oven

28 October 2009 Manufacturing / Production Technology, Hardware & Services

Essemtec’s RO300FC-C is a full convection oven that allows fast and homogenous heating, as well as high-temperature soldering of sensitive electronics. The integrated convection technology offers an innovative and efficient way of heating – with a vertical hot air stream that evenly heats the complete PCB. Both standard and lead-free pastes can be used.

As an innovative new feature, the oven features RO-CONTROL software for increased process simulation and control. RO-CONTROL combines all the important functions for the process evaluation and process control for reflow ovens. This advanced software offers many of the same features as thermal profilers, but for a lower price.

The high air volume of the RO300FC-C guarantees equal heating rates in all the components and the substrate, which leads to a minimum delta-T and guarantees a perfect soldering process at every location on the PCB. This 2 metre long oven offers many of the same options – including chain conveyor for double-sided boards, computer control and an N2 option – as those available on far more expensive ovens.

The temperature of the pre-heat and peak zones, along with the conveyor speed, are programmable to obtain the required soldering profile. Measuring the zone temperatures directly in the convection airflow guarantees reproducible results with low delta-T values (±2°C). Different profiles for solder and glue are already integrated in the microprocessor control. The RO300FC-C can be used for prototypes, small batches and production runs up to 700 boards in an eight-hour shift.

RO-CONTROL software enables the simulation of soldering profiles at different settings and the comparison with a solder paste library. The number of profiles managed with the software is unlimited. The software also controls and supervises the reflow oven, ensuring safe operation. A saved parameter set can be selected from the profile library and can be transmitted to the reflow oven. RO-CONTROL steers and supervises the oven, and the actual status is displayed on the screen. Additionally, the paste editor allows the design and saving of profile references for different solder pastes. These references can be used by the profile simulator for comparison. The software also has the capability to save the process changeover to a lead-free process.

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