DSP, Micros & Memory


Freescale expands i.MX51 microprocessor range

20 January 2010 DSP, Micros & Memory

The Freescale i.MX51 product family has been expanded to include new processors designed for use in automotive, industrial and consumer markets.

The new devices are the i.MX514 and i.MX516 processors for automotive applications and the i.MX512 and i.MX513 processors for industrial and consumer applications.

All devices in the i.MX51 family are pin-compatible and based on Freescale’s implementation of the ARM Cortex-A8 core. The products integrate five processing engines and deliver a variety of video, graphics and multimedia feature combinations to meet specific market requirements. The products feature an array of connectivity options and support multiple memory types, including DDR2. To streamline development and deliver a more comprehensive solution across multiple markets, Freescale offers board support packages (BSPs) for the Linux OS, Windows Embedded CE6.0 and the Android OS, all optimised for the i.MX51 family.

The i.MX512 and i.MX513 devices are designed to meet critical industrial market requirements such as user interfaces, sophisticated graphics processing and extensive connectivity options. Both devices deliver 600 MHz performance at industrial temperature ranges, and the i.MX513 additionally incorporates hardware video encode/decode functionality. Industrial applications for the processors include printers, factory automation equipment, medical devices, digital signage, home appliances and human-machine interface technology. The devices are also available in consumer versions, with the core performance enhanced to 800 MHz.

The i.MX514 and i.MX516 processors are planned for AEC-Q100 qualification and designed for a variety of in-dash and after-market automotive applications. Delivering 600 MHz performance at automotive temperature ranges, the products are suitable for display-based instrument clusters, navigation, telematics and infotainment platforms, as well as other automotive applications. They include advanced graphics capabilities, and the i.MX516 additionally incorporates a powerful video encode/decode hardware engine to provide multimedia experiences for drivers and passengers.

For more information contact EBV Electrolink, +27 (0)21 402 1940, [email protected], www.ebv.com



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Accelerate development of physical AI deployments
Altron Arrow DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N- AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.

Read more...
AI-ready edge MPU for HMIs
Future Electronics DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.

Read more...
Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.

Read more...
Universal NFC device
Altron Arrow DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.

Read more...
Compact low-power 32-bit platform
EBV Electrolink DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.

Read more...
Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.

Read more...
Low-power memory born for edge AI
iCorp Technologies DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.

Read more...
Compact direct Time-of-Flight 3D LiDAR module
Altron Arrow AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.

Read more...
Next-gen smart module powers intelligence at the edge
iCorp Technologies DSP, Micros & Memory
Quectel Wireless Solutions has expanded its smart module portfolio with the SH803FD, a new-generation, high-performance smart module.

Read more...
Programmable logic redefined
DSP, Micros & Memory
Microchip’s CLB-based PIC MCUs combine programmable logic and embedded control in a single device to help reduce latency, cost, and design complexity.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved