STMicroelectronics has released a robust low-power processor chip dedicated to managing SIM data for machine-to-machine (M2M) cellular communications, a growing market that could account for over 200 million mobile connections by 2013, according to an August 2009 report by Beecham Research.
The ST32-M IC family combines the advantages of a non-proprietary processor architecture and high-density embedded Flash memory, enabling machines to connect to cellular networks and to authenticate themselves and communicate automatically. M2M applications include automatic utility-meter reading; retail systems, such as replenishment monitoring for vending machines; security equipment; and asset-management systems.
To communicate with the cellular network, the ST32-M has the same capabilities and security features as the company’s existing ST32 smartcard processor, which is used in cellphone SIM cards worldwide. The ST32-M is designed explicitly for M2M applications, with a wider temperature range (-40°C to 105°C) allowing M2M equipment to function in harsh environments. The chip also supports many more data-writing cycles than the standard SIM controller, enabling continuous operation over an extended lifetime. It will also store data reliably for more than 10 years.
Like ST’s ST32 family, the ST32-M uses the ARM Cortex-M3 embedded processor core. The ST32-M family is available in four variants having Flash density of 256 KBytes, 320 KBytes, 416 KBytes or 512 KBytes. The integrated memory supports total data cycling of 500 000 cycles per page or 50 million cycles per sector.
Wi-Fi 6 and Bluetooth LE co-processor Altron Arrow
Telecoms, Datacoms, Wireless, IoT
STMicroelectronics has released its ST67W611M1, a low-power Wi-Fi 6 and Bluetooth LE combo co-processor module.
Read more...Improving accuracy of outdoor devices iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
In a real-world environment, accessing a direct satellite signal is not always possible, and it cannot be relied upon as the only solution to provide a device with accurate location at all times.
Read more...New 3dB hybrid couplers Electrocomp
Telecoms, Datacoms, Wireless, IoT
Designed to facilitate the continued evolution of high-frequency wireless systems in various market segments, the new DB0402 3dB 90° hybrid couplers provide repeatable high-frequency performance compatible with automated assembly.
Read more...Next-level Software Defined Radio IOT Electronics
Telecoms, Datacoms, Wireless, IoT
Great Scott Gadgets has announced the HackRF Pro, a powerful evolution of its popular Software Defined Radio (SDR) platform designed for engineers and enthusiasts.
Read more...High-performance Zigbee and BLE module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The KCMA32S from Quectel boasts an ARM Cortex-M33 processor with a frequency of up to 80 MHz, and supports Zigbee 3.0, BLE 5.3 and BLE mesh.
Read more...Championing local PCB manufacturing Master Circuits
Telecoms, Datacoms, Wireless, IoT
Master Circuits, founded in 1994 by Peter Frankish in Durban, was born from the vision to meet the growing local demand for quick-turnaround printed circuit boards in South Africa.
Read more...IoT-optimised LTE Cat 1 bis module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel’s EG915K-EU is an LTE Cat 1 bis wireless communication module specially designed for M2M and IoT applications.
Read more...1-Wire EEPROM with secure authenticator Altron Arrow
DSP, Micros & Memory
The DS28E54 secure authenticator combines FIPS 202-compliant secure hash algorithm (SHA-3) challenge and response authentication with secured electrically erasable programmable read-only memory.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version