Aries Electronics has introduced a new Kelvin test socket that handles devices with a lead pitch down to 0,4 mm. It uses two independent Aries Kelvin spring probes per device pad for highly reliable, low-resistance testing of MLF, QFN, LGA and other leadless devices.
With a signal path of only 2,08 mm, the test socket provides minimal signal loss for high bandwidth capability. The socket’s low cost, two-piece construction and small overall size allows a high number of sockets per test board. The operator-friendly, low-profile socket uses solderless pressure mount compression spring probes accurately located by two moulded plastic alignment pins and mounted with four stainless steel screws, allowing for easy mounting and removal from the test board.
For increased reliability, the gold-over-nickel-plated probes leave very small witness marks on the bottom surface of the device pads. The probes are constructed of heat-treated beryllium-copper with a minimum of 1,27 micron gold per Mil-G-45204 over 1,27 micron nickel per SAE-AMS-QQ-N-290. The pressure pad compression spring provides proper force against the device and allows for height variations in device thickness. A probe blade edge tip ensures cutting through solder oxides layers for use in applications with RoHS-coated or gold pads.
Contact forces are 16 g per contact on a 0,40 mm to 0,45 mm pitch. The probe can operate in temperatures from -55°C to 150°C and contact life is an estimated minimum of 500 000 cycles. The Kelvin test socket contact system is available for any Aries CSP test socket.
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