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Dataweek Electronics & Communications Technology Magazine

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Electronics Buyers' Guide

Electronics Manufacturing & Production Handbook 2019

3 February 2010

  Tellumat invests to exploit economic upsurge

With a brimming order book for most of its units, Tellumat expects sales and profit growth of at least 30% for the period ending in September 2010

  SMART develops solder paste standard

This new standard provides a user-friendly test procedure that may be conducted in less than an hour

  Telit emphasises support for local market

Telit Wireless Solutions Africa is set to speed up its expansion in Africa by increasing its investment in technology expertise

  SIMCom module wins GSMA award
Otto Marketing, News

The award-winning SIM5215 is a cost-effective industrial WCDMA/GSM wireless module, which has a compact design with rich interfaces, and is operable in extended temperature ranges

  VIA shrinks COM form factors, again

Mobile-ITX is currently the most compact COM form factor on the market, an incredible 50% smaller than the successful VIA-developed Pico-ITX form factor

Technical Literature
Analogue, Mixed Signal, LSI
Circuit & System Protection
Computer/Embedded Technology
Design Automation
DSP, Micros & Memory
Manufacturing / Production Technology, Hardware & Services
Passive Components
Power Electronics / Power Management
Programmable Logic
Telecoms, Datacoms, Wireless, IoT
Test & Measurement

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