Interconnection


Contacts offer angular alignment

3 March 2010 Interconnection

ITT has enhanced its family of Universal Contacts to suit applications requiring angular alignment.

The Universal Contact for angular alignment provides a vertical electrical connection between a device and a printed circuit board, while also allowing angular mating in the same footprint as a standard Universal Contact.

The Universal Contact for angular alignment features a sloped front beam, enabling a mating angle of 90° while still retaining the same dimensions as standard Universal Contacts (2,5 mm free height, 1,0 mm deflection and X-Y-Z movement). A solder well prevents wicking of flux solder into the critical beam area, and side wings prevent beam overstress. Additional features include a domed contact for high hertz forces, minimum pre-load force of 0,3 N, contact pitch of 1,35 mm and voltage rating to 500 V d.c.

For more information contact Marian Ledgerwood, Future Electronics, +27 (0)21 421 8292, [email protected], www.futureelectronics.com



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