Logic Devices’ IMOD family of DDR memory products is based on integration of multiple silicon devices, manufactured on an organic laminate substrate and encapsulated with industry standard plastic encapsulating materials providing suitability of use in industrial, extended and Mil-temp applications.
The thermally enhanced IMOD package adds, via packaging IP, a method for improving the thermal conductivity by providing a low resistance thermal path to the package topside, in addition to the thermal properties normally associated with BGA packaging. This packaging technology promotes excellent thermal relief via the bottom side interface, as well as adding an improved thermal path via the topside package surface.
The IMOD family is available in a range of sizes and packages, from 1 GB DDR1 memory with a data transfer rate of 333 MHz to 4,5 GB DDR3 memory with a data transfer rate of 1333 MHz.
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