FCI has released its new high power card edge (HPCE) connector, intended for applications demanding low power loss and high linear current density. The connector is rated to 9 A per power contact beam (with multiple power contacts fully energised) without exceeding a 30°C temperature rise in still air. The connector has a low profile height (≤7,50 mm) and is based on highly reliable stamped-and-formed power contact technology.
HPCE connectors are available with power and signal contacts integrated into a single moulded housing for power distribution and power control. The flexible, modular tooling approach used for the connector makes it highly configurable in terms of the number and placement of the power and signal contacts for custom power needs.
The HPCE connector features a low profile height for increased system airflow and heat dissipation, low contact resistance characteristics, highly linear current density, a robust housing with touch-proof safety features and a polarisation option to ensure proper mating. Vertical and right-angle options are available to accommodate various system architectures.
Microchip expands maXTouch M1 touchscreen controller Altron Arrow
DSP, Micros & Memory
Microchip Technology has again expanded its maXTouch M1 family of touchscreen controllers, now covering free-form widescreen format displays up to 42 inches down to small compact screens in the 2 to 5 inch range.
Read more...ToF sensor with 6 m range Altron Arrow
Test & Measurement
Specifically designed for long-range, multitarget measurements, the VL53L4CX from ST Microelectronics provides very accurate distance measurements up to 6 m with excellent results over short distances.
Read more...Microchip expands its Arm Cortex-M0+ portfolio Altron Arrow
DSP, Micros & Memory
PIC32CM PL10 MCUs feature a rich set of Core Independent Peripherals, 5 V operation, touch capabilities, integrated toolsets, and safety compliance.
Read more...More room to scale Altron Arrow
Power Electronics / Power Management
With the latest STM32H5 lines from STMicroelectronics, you can now scale within the same platform, from a compact 1 Mbyte device to higher-memory MCUs for graphics-rich and feature-heavy designs.
Read more...4 mm pitch power connectors Spectrum Concepts
Interconnection
Mill-Max has introduced a new line of high-reliability, 4 mm (.157”) pitch sockets and headers designed for power connections and rugged field applications.
Read more...56 G MezzaWave connectors and cable assemblies
Interconnection
Engineered to deliver notable signal integrity, TE Connectivity’s high-speed, high-density 56 G MezzaWave connector family is built on an open-pin-field array platform that supports data rates up to 56 Gbps PAM4 for next-generation modular system
Read more...Space SMPM and SMPM-Lock connectors Hiconnex
Interconnection
Radiall has released the Space SMPM and SMPM-Lock, miniature Space connectors for high-frequency performance and high-density applications.
Read more...Compact, high density, heavy duty, thermoplastic connectors TRX Electronics
Interconnection
Amphenol Sine Systems ATD series connectors, available from Mouser, are a compact, high density, heavy duty, thermoplastic solution with superior environmental seals and end caps for exceptional rear seal retention.
Read more...Samtec supports SGeT oHFM.c with high-performance interconnects Spectrum Concepts
Interconnection
Samtec has announced a new product portfolio designed for the SGeT oHFM.c standard. These connectors are based on Samtec’s proven AcceleRate HD and AcceleRate HP high-density, high-performance product families.
Read more...Multi-constellation GNSS module in a legacy-compatible footprint Altron Arrow
Telecoms, Datacoms, Wireless, IoT
Telit Cinterion has announced the SE869eK2L, a single-frequency L1 GNSS module designed to help device manufacturers upgrade legacy positioning designs with improved performance and cost efficiency, while preserving design continuity.
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