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Electronics Buyers' Guide

Electronics Manufacturing & Production Handbook 2019


 

Low-profile heatsinks
28 April 2010, Circuit & System Protection

Advanced Thermal Solutions has introduced a line of lower height maxiFLOW heatsinks for cooling ICs and other hot components in narrow packaging and low airflow velocity conditions. The heatsinks feature a spread fin array that maximises surface area for more effective convection (air) cooling. Standard sink heights are as low as 9,5 mm.

The heatsinks are fabricated from extruded aluminium which minimises thermal resistance from the base to the fins and minimises weight. maxiFLOW heatsinks are provided pre-assembled with ATS maxiGRIP mounting hardware, which includes a plastic frame clip that snaps securely around the component. A stainless steel spring clip runs through the fin field and fastens to the frame. The result is steady, even mounting pressure with no holes in the PCB. These assemblies meet Telcordia GR-63-Core; ETSI 300 019; and MIL-STD-810 shock and vibration testing standards. A thermally conductive, phase-change interface pad maximises the heat transfer from component to heatsink.

For more information visit www.qats.com


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