Infineon’s MIPAQ base development unites the latest IGBT technology with internal sensors for accurate current sensing in the well-established EconoPACK 3 package. The 1200 V, 75–150 A solution is targeted at industrial and servo drives with up to 55 kW, as well as UPS, air conditioning systems and solar inverters.
Connected to the output lines, the shunts enable compact and accurate current measurement while their mounting position inside the module improves the thermal situation. Hot spots are moved from the PCB to the heatsink, thus achieving excellent cooling without increasing the space necessary for setup.
High-quality materials ensure exact measurement across the entire temperature range and pave the way for excellent power cycling capabilities. Other features of this technology include the absence of offset and hysteresis voltage as well as insensitivity to over-current and peak current conditions.
Next-gen power meter Electrocomp Express
Power Electronics / Power Management
The VT-PWR-LV is a next-gen Vista Touch power meter from Trumeter for single, split, and three-phase systems.
Read more...New 3dB hybrid couplers Electrocomp
Telecoms, Datacoms, Wireless, IoT
Designed to facilitate the continued evolution of high-frequency wireless systems in various market segments, the new DB0402 3dB 90° hybrid couplers provide repeatable high-frequency performance compatible with automated assembly.
Read more...Advanced PMIC for high-performance AI applications ASIC Design Services
Power Electronics / Power Management
Microchip Technology has announced the MCP16701, a Power Management Integrated Circuit (PMIC) designed to meet the needs of high-performance MPU and FPGA designers.
Read more...Robust series of vertical-mating battery connectors Electrocomp
Interconnection
KYOCERA AVX has further expanded its industry-leading selection of standard battery connectors with the introduction of the new 9155-900 Series 2,5 mm-pitch vertical-mate battery connectors.
Read more...New SiC power MOSFET Future Electronics
Power Electronics / Power Management
STMicroelectronics’ SCT012H90G3AG is a robust, automotive-grade SiC MOSFET, engineered for demanding power electronics, featuring a 900?V drain-source voltage and exceptionally low on-resistance of 12?mO at 60?A.
Read more...Chip provides concurrent dual connectivity EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
The IW693 from NXP is a 2x2 dual-band, highly integrated device that provides concurrent dual Wi-Fi 6E + Wi-Fi 6 and Bluetooth connectivity, supporting four different modes.
Read more...Fundamental motor control design challenges and solutions
Power Electronics / Power Management
Mouser Electronics has announced a new eBook in collaboration with Qorvo, featuring industry experts providing key insights into methods, power efficiency and integration solutions available for motor control applications.
Read more...Power management IC for battery products
Power Electronics / Power Management
The nPM1304 PMIC complements Nordic’s nPM1300 PMIC with a highly integrated, ultra-low power solution and precision fuel gauging for small size battery applications.
Read more...Dual-range IMU with edge processing EBV Electrolink
Analogue, Mixed Signal, LSI
ST’s innovative LSM6DSV80X combines two accelerometer structures for 16 g and 80 g full-scale sensing, a gyroscope up 4000 dps, and embedded intelligence in a single component.
Read more...Powering Innovation eBook: Changing what’s possible
Power Electronics / Power Management
This exclusive read, entitled ‘Changing what’s Possible,’ delves into how power dense Vicor modules enable many world-changing innovations across various sectors.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version