Dielectric for high-power LED lighting

Manufacturing / Production Technology, Hardware & Services

Production/manufacturing equipment suppliers & service providers

21 July 2010 Manufacturing / Production Technology, Hardware & Services

Optimised for high-power LED lighting and other applications requiring enhanced heat-transfer efficiency, Bergquist’s new HPL (high-power lighting) dielectric for Thermal-Clad substrates enables low operating temperatures, high LED driving currents and reduced component count.

The new dielectric has a high thermal conductivity of 3,0 W/m-K, resulting in a very low thermal resistance of only 0,13°Ccm²/W. The dielectric thickness is 38 μm, and is available on all Bergquist Thermal Clad aluminium and copper insulated metal substrates. Displaying superior thermal performance compared to standard FR4 PCBs, Thermal Clad HPL is supplied as scored array circuits, scored singulated circuits or punched singulated parts.

By efficiently removing heat generated from surface-mounted high-power LEDs, Thermal Clad HPL promotes reliability by minimising the operating temperature for a given LED driving current. Engineers thus gain extra freedom to optimise light output, component count and lumen maintenance in equipment such as energy-saving lamps, LED-based bulb replacements, signage, stage lighting and display backlights.

With a maximum operating temperature of 150°C and continuous operating voltage of 170 V d.c. (120 V a.c.), the new dielectric can be used in a wide variety of environments and applications.

For more information visit www.bergquistcompany.com

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Dielectric for high-power LED lighting

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