For design engineers with the requirement for a compact infrared sensor, Optek Technology has developed a small surface mount packaged photo light sensor with a digital output. Designated the OPL611 series, the sensors feature data rates to 250 Kbps and consist of a Photologic chip encapsulated in transparent moulded plastic, providing optical coupling as well as mechanical protection. The hysteresis characteristics of the Schmitt trigger on each device gives them high noise immunity, making them suited to use in a variety of sensing applications, including machine automation and safety, assembly line automation, non-contact reflective object and interruptive sensing, as well as end-of-travel, object and paper sensing.
The surface mount sensors measure 3 x 3 mm with a height of 1 mm, and are mechanically and spectrally matched to Optek’s OP180, OP200, OP250, OP270 and OP280 series infrared LEDs. Available with buffer and inverter 10 K internal pull-up as well as open collector outputs, the sensors feature a direct TTL/LSTTL CMOS interface. Minimum input power is 1,0 mW/cm², VCC ranges from 4,5 to 16 V, and operating temperature ranges from -40°C to +85°C.
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The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
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These models from Hammond Manufacturing, the 1590TRP and 1590STP, provide additional flexibility for product designers who require strong aluminium enclosures, but want alternatives to the traditional rectangular form factor.
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