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Electronics Buyers' Guide

Electronics Manufacturing & Production Handbook 2019


 

New DSP gets simplified development platform
18 August 2010, DSP, Micros & Memory

Texas Instruments recently announced the introduction of a new development platform and a new speed grade option for the TMS320C6457 digital signal processor (DSP). The simplified development platform, coupled with the TMS320C6457 – 850 MHz device, will allow customers in markets such as defence, networking, test, imaging and industrial to quickly ramp up their development efforts while providing design flexibility and upgradeability to existing TMS320C6457 processors. TI also provides a pin compatible upgrade path to 1 GHz and 1,2 GHz versions of this device.

The new TMDSEVM6457L is an easy-to-use development tool which includes robust connectivity options such as a breakout card, allowing customers to individually connect certain peripherals to configure the EVM for their needs. The EVM also comes bundled with free software including a copy of TI’s Code Composer Studio (CCS v4.2) development environment, as well as other production and demonstration software components.

Based on TI’s TMS320C64x+ DSP core, the 850 MHz to 1,2 GHz C6457 delivers 6800 (16-bit) MMACS to 9600 MMACs of peak performance and a cycle for cycle performance improvement of up to 30% compared to the previous DSP generation. Further performance improvements are enabled by 2 MB of on-chip L2 memory (up to 1 MB cacheable), faster 32-bit DDR2 EMIF (667 MHz) and memory, cache and bus architecture enhancements.

High-speed interconnect is possible with Serial RapidIO (SRIO) and Gigabit Ethernet MAC serialiser/deserialiser (SERDES) interfaces for efficient inter-processor communications. On-chip acceleration for wireless applications is provided with two Turbo-Decoder Coprocessors (TCP2) and one Viterbi Coprocessor (VCP2). This offloads the compute intensive Forward Error Correction (FEC) functionality from the DSP core, freeing it for other processing functions and tasks.

For more information contact EBV Electrolink, +27 (0)21 402 1940, capetown@ebv.com, www.ebv.com


Credit(s)
Supplied By: EBV Electrolink
Tel: +27 11 236 1900
Fax: +27 11 236 1913
Email: saro.murabito@ebv.com
www: www.ebv.com
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Further reading:

  • Mixed-signal MCUs for digital power
    26 June 2019, EBV Electrolink, DSP, Micros & Memory
    Targeted at advanced digital power applications and consumer and industrial appliances, the new STM32G4 microcontrollers (MCUs) introduce two new hardware mathematical accelerators to boost processing ...
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    29 May 2019, Altron Arrow, DSP, Micros & Memory
    STMicroelectronics is applying its Arm Cortex expertise to expand the capabilities of its STM32 microcontroller (MCU) portfolio to applications requiring even more performance, resources and large open-source ...
  • MCUs for advanced security and physical protection
    29 May 2019, EBV Electrolink, DSP, Micros & Memory
    The new K32 microcontroller (MCU) series from NXP Semiconductors is optimised for energy efficiency in real-time embedded applications, and enables advanced security with physical tamper protection in ...
  • MCUs with water-tolerant touch integration
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  • Wi-Fi microcontroller
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    The ESP32-S2 from Espressif Systems is a highly integrated, low-power, 2,4 GHz Wi-Fi microcontroller SoC (system-on-chip) supporting Wi-Fi HT40 and 43 general-purpose I/Os. Based on an Xtensa single-core ...
  • DSCs with USB and CAN FD support
    29 May 2019, EBV Electrolink, DSP, Micros & Memory
    NXP Semiconductors’ MC56F83xxx digital signal controllers (DSC) family offers peripheral enhancements ideal for high-performance digital power conversion and advanced motor control applications. The ...
  • PoE chipset for PDs
    30 April 2019, EBV Electrolink, Power Electronics / Power Management
    A new chipset from STMicroelectronics lets users quickly build reliable and space-efficient Powered Devices (PDs) to take advantage of the latest IEEE 802.3bt Power-over-Ethernet (PoE) specification. ...

 
 
         
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