Passive Components


Precision resistors

18 August 2010 Passive Components

Vishay has announced a new series of high-precision Bulk Metal Z-Foil resistors built using Z1-Foil technology that features enhanced accuracy, stability and fast thermal stabilisation in sizes small enough for permanent assembly in operational equipment.

The SMR3P devices feature a TCR of ±0,5 ppm/°C maximum (+25°C to


+125°C), tolerances to 0,01%, load-life stability of ±0,005% (50 ppm) after 10 000 hours with 0,6 W at 70°C, and PCR (ΔR due to self-heating) of ±5 ppm at a rated power of 0,6 W at +70°C or 0,3 W at +125°C.

The SMR3P series is targeted at feedback devices for operational amplifiers, precision voltage dividers, precision bridge resistors and decade voltage dividers in precision amplifiers; high-precision instrumentation; medical, industrial, high-end stereo and automatic test equipment; electron beam and pulse applications; and measurement instrumentation.

Chips of 1206 and larger dimensions occasionally delaminate from the PCB or develop cracks due to the stresses introduced by handling of the PCB and thermal shock. The SMR3P features a moulded package with flexible terminations that ensure minimal stress transference from the PCB due to load-induced temperature gradients and a difference in thermal coefficient of expansion (TCE). The SMR3P’s low absolute TCR reduces errors due to temperature gradients, thus reducing a major source of uncertainty in precision circuits. The resistors can withstand unconventional environmental conditions, including the extremely high temperatures and radiation-rich environments of down-hole oil exploration and well logging, or the deep-sea underwater repeaters in cross-ocean communications.

The SMR3P series features electrostatic discharge (ESD) immunity up to 25 000 V, a thermal stabilisation time of <1 second (nominal value achieved within 10 ppm of steady-state value), current noise of 0,010 μVRMS/V of applied voltage (<-40 dB) and a voltage coefficient of <0,1 ppm/V. The devices offer a resistance range of 100 Ω to 15 kΩ. Vishay Foil resistors are not restricted to standard values, and can be supplied with ‘as required’ values (eg, 1,0002 kΩ vs. 1 kΩ) at no extra cost or delivery time. The resistors offer a non-inductive


(< 0,08 μH), non-capacitive design and feature lead-free or tin/lead alloy terminal finishes.

For more information contact Marian Ledgerwood, Future Electronics, +27 (0)21 421 8292, [email protected], www.futureelectronics.com



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Next generation HMI processing platform
Future Electronics DSP, Micros & Memory
Microchip’s latest hybrid MCU SiP integrates an Arm926EJ-S processor with 512 Mb of DDR2 SDRAM and is engineered to meet the rising demand for sophisticated HMI solutions in modern vehicles.

Read more...
Compact high-current power inductor
EBV Electrolink Passive Components
Vishay’s IHLP series power inductors deliver high current capability in an ultra-low profile, magnetically shielded design.

Read more...
Tiny noise suppression filters
RS South Africa Passive Components
TDK Corporation recently announced its latest noise suppression filters of the MAF0603GWY series, which measure only 0,6 x 0,3 x 0,3 mm.

Read more...
Compact 1250 V choke solution
Electrocomp Passive Components
TDK Corporation has introduced a new high-voltage common-mode choke series designed to support more compact and efficient 1250 V DC converter architectures in next-generation power electronics.

Read more...
MIL-spec connector series
Future Electronics Interconnection
The MIL-HD2 connector series from Amphenol is the company’s next-generation, SOSA-aligned solution engineered to meet the most demanding requirements of modern military embedded systems.

Read more...
Next-generation HMI and vision processing
Future Electronics Edge Computing & IIoT
The Renesas RA8D2 group of microcontrollers delivers ultra-high performance for next-generation graphics, HMI, and vision-driven designs that demand fast response, rich visual interfaces, and embedded AI capability.

Read more...
Chip for high-density power
Future Electronics DSP, Micros & Memory
Microchip’s dsPIC33AK256MPS306 Digital Signal Controllers combine high-resolution control, high-speed analogue, and security with support for post-quantum cryptography.

Read more...
Advanced industrial connectivity at the edge
Future Electronics Computer/Embedded Technology
Dual 4K display capabilities, ultra-efficient processing, and versatile mounting options make the Intelli TWL01 Edge the ultimate embedded platform for multimedia solution building.

Read more...
Tiny power inductor for low noise applications
iCorp Technologies Passive Components
With the evolution of Bluetooth, chips, sensors and other technologies, the design of TWS earphones is becoming smaller and thinner, and the performance and size requirements of integrated inductors need to follow suit.

Read more...
Compact high precision magnetometer
Future Electronics Test & Measurement
Bosch Sensortec has introduced the BMM350, a compact 16-bit, 3-axis magnetometer engineered to deliver high accuracy, low noise, and exceptional energy efficiency in space constrained designs.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved