Texas Instruments has released its new MSP430 MCU Value Line LaunchPad development kit. The open source kit includes all of the hardware and software needed to launch designs based on TI’s MSP430 Value Line MCUs. LaunchPad supports rapid prototyping and development by allowing developers to quickly drop-in MSP430 Value Line MCUs to evaluate, program or debug devices. This flexibility allows developers to remove programmed devices to be placed on a custom board, or remain plugged into LaunchPad to leverage onboard buttons, LEDs and breakout pins for external components.
The development kit features a DIP target socket supporting up to 20-pin devices and allows programmed MCUs to be easily removed and placed into custom PCBs and breadboards. An integrated, USB-powered emulator permits Flash programming, firmware debugging and serial communication. LaunchPad interfaces with any MSP430 Value Line MCU, existing eZ430 target boards and MSP430 devices with Spy Bi-Wire capabilities. To complement the kit, free compilers and debuggers are available for download, including Code Composer Studio IDE and IAR Embedded Workbench, providing a complete software development environment.
A 32 kHz crystal increases MSP430 MCUs’ integrated, digitally controlled oscillator to real-time accuracy for various peripherals and timers. Two MSP430 Value Line devices are included; one pre-programmed with demo firmware to demonstrate the use of on-chip peripherals, including 10-bit ADC, comparators and internal temperature sensor. The development kit’s open-source design allows developers to create their own hardware based on LaunchPad.
General-purpose MCU with RISC-V architecture EBV Electrolink
DSP, Micros & Memory
Renesas has released a general-purpose MCU to enhance its existing RISC-V portfolio, and this is its first MCU using a RISC-V core developed internally at the company.
Read more...AI-native IoT platform launched EBV Electrolink
AI & ML
These highly-integrated Linux and Android SoCs from Synaptics are optimised for consumer, enterprise, and industrial applications and deliver an ‘out-of-the-box’ edge AI experience.
Read more...Serial SRAM up to 4 MB EBV Electrolink
DSP, Micros & Memory
The chips are designed to provide a lower-cost alternative to traditional parallel SRAM products, and include optional battery backup switchover circuitry in the SRAM memory to retain data on power loss.
Read more...Microchip expands its mSiC solutions EBV Electrolink
Power Electronics / Power Management
The highly integrated 3,3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration.
Read more...Powering up the intelligent edge EBV Electrolink
DSP, Micros & Memory
STMicroelectronics is releasing new devices from the second generation of its industrial microprocessors (MPUs), the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
Read more...New Studio 6 SDK
Design Automation
New Simplicity Studio 6 SDK opens development environment, and opens developers to Series 3.
Read more...Flash for AI EBV Electrolink
AI & ML
SCM offers a midway latency point between DRAM and SSDs, and when coupled with the introduction of CXL, low-latency flash, such as XL-FLASH, is well-positioned to deliver improvements in price, system performance, and power consumption to everything from servers to edge devices deploying the power of AI.
Read more...UFS Ver. 4.0 embedded Flash memory devices EBV Electrolink
Computer/Embedded Technology
KIOXIA Europe has announced sampling of the industry’s first Universal Flash Storage (UFS) version 4.0 embedded Flash memory devices designed for automotive applications.
Read more...InnoSwitch5 Offline Flyback Switcher IC EBV Electrolink
Power Electronics / Power Management
ero-voltage switching (ZVS) flyback topology and advanced SR FET control enable 95% efficiency, together with reduced power supply size and component count.
Read more...IGBT power module EBV Electrolink
Power Electronics / Power Management
The company has now released its new half-bridge IGBT power modules offered in its redesigned INT-A-PAK package.
printer friendly version