FCI recently demonstrated a 20+ Gbps data stream over its new high-density TwinMezz mezzanine connector system, which was also named a finalist in the 2010 DesignVision Awards programme in the interconnect technologies and components category by the International Engineering Consortium (IEC).
The TwinMezz connectors exhibit very well-matched impedance, low insertion loss and low crosstalk, which make them well suited for applications in very high-speed environments. Configurations with six differential signal pairs per column provide high signal density, delivering 25 high-speed signal pairs in a square centimetre. The innovative hermaphroditic design mates to itself and supports stack heights ranging from 12 mm to 40 mm with 200 to 800 total contacts.
The connector system provides enhanced flexibility with options for integrated moulded or optional metal guides and the capability to mix signal and power wafers in a single connector. The versatile open pin field design offers additional flexibility by allowing for mixed differential, single-ended or power pin assignments in a single connector. TwinMezz connectors also feature FCI’s patented BGA connector termination for easy surface-mount attachment and efficient trace routing.
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