Telecoms, Datacoms, Wireless, IoT


PA gain blocks for cellular infrastructure

29 September 2010 Telecoms, Datacoms, Wireless, IoT

Avago Technologies has announced four new gain block solutions that feature high linearity, high gain, excellent gain flatness and low power dissipation. The performance of the MGA-31189 and MGA-31289 0,25 Watt and MGA-31389 and MGA-31489 0,10 Watt gain blocks is made possible by Avago’s proprietary, 0,25 μm GaAs Enhancement-mode pHEMT semiconductor process.

The power amplifier family is optimised for frequency in order to perform across major cellular frequency bands. A common footprint and PCB layout allows a single design to support multiple frequencies and geographic markets with a choice of output power. The devices feature high gain which can reduce the total number of RF stages needed. The MGA-31189 and MGA-31389 serve applications from 50 MHz to 2,0 GHz and the MGA-31289 and MGA-31489 from 1,5 GHz to 3,0 GHz.

For more information contact EBV Electrolink, +27 (0)21 402 1940, [email protected], www.ebv.com



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Full sensor to cloud solution
CST Electronics Telecoms, Datacoms, Wireless, IoT
NeoCortec has demonstrated the seamless and rapid development of full sensor-to-cloud solutions using NeoMesh Click boards from MikroE and the IoTConnect cloud solution from Avnet.

Read more...
Long-range Wi-Fi HaLow module
TRX Electronics Telecoms, Datacoms, Wireless, IoT
One of Mouser’s newest products is the Morse Micro MM6108-MF08651-US Wi-Fi HaLow Module, which adheres to the IEEE 802.11ah standard.

Read more...
Quectel launches 3GPP NTN comms module
Quectel Wireless Solutions Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has announced the Quectel BG95-S5 3GPP non-terrestrial network (NTN) satellite communication module.

Read more...
SIMCom’s A7673x series
Otto Wireless Solutions Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat.1 bis module based on the ASR1606 chipset, that supports wireless communication modes of LTE-FDD, with a maximum downlink rate of 10 Mbps and a maximum uplink rate of 5 Mbps.

Read more...
Accelerating the commercialisation of the 5G IoT markets
Altron Arrow Editor's Choice Telecoms, Datacoms, Wireless, IoT
Fibocom unveils Non-Terrestrial Networks (NTN) module MA510-GL, enabling satellite and cellular connectivity to IoT applications.

Read more...
General-purpose MCU with RISC-V architecture
EBV Electrolink DSP, Micros & Memory
Renesas has released a general-purpose MCU to enhance its existing RISC-V portfolio, and this is its first MCU using a RISC-V core developed internally at the company.

Read more...
AI-native IoT platform launched
EBV Electrolink AI & ML
These highly-integrated Linux and Android SoCs from Synaptics are optimised for consumer, enterprise, and industrial applications and deliver an ‘out-of-the-box’ edge AI experience.

Read more...
Serial SRAM up to 4 MB
EBV Electrolink DSP, Micros & Memory
The chips are designed to provide a lower-cost alternative to traditional parallel SRAM products, and include optional battery backup switchover circuitry in the SRAM memory to retain data on power loss.

Read more...
Long-range connectivity module
Avnet Silica Telecoms, Datacoms, Wireless, IoT
Digi XBee XR 868 RF Modules support the deployment of long-range connectivity applications, and support point-to-point and mesh networking protocols.

Read more...
4G LTE-M/NB-IoT connectivity reference design
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Developed around the industry-leading Nordic nRF9160 module, the platform comes complete with a newly-developed LTE antenna, ATRIA, which is pre-certified to operate over the full LTE-M and NB-IoT bands.

Read more...