27 October 2010Manufacturing / Production Technology, Hardware & Services
The need to reduce PV (photovoltaic) manufacturing costs, combined with the present shortage of polysilicon feedstock, is driving a steady reduction in wafer and cell thicknesses. Hand soldering of tabs and stringers without causing damage or latent defects to the cells is one of the steps that has become more challenging. Cells can break during the process or crack in the completed modules. Process equipment such as soldering irons must adapt in order to maintain high yields with acceptable mechanical and module reliability as the industry shifts the wafer thickness below 200 microns.
The ability to solder at low, controlled temperatures (connection temperatures must be maintained below 300°C) within a short time window, also reduces the stresses on the cells and the likelihood of micro-cracking, while still producing a controlled, high quality solder joint. OK International’s PS-900-Solar soldering system offers ease of use and unique SmartHeat Technology, which supplies power on demand using a calibration-free system that reacts instantly to changing thermal demands, thus minimising thermally induced stresses on the surface of the solar cells. The system, combined with the specially designed STV-DRH440A hoof tip, optimises the power delivered to the solder joint to provide high performance and efficiency with increased tip life.
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The integration of machine learning into robotics has the potential to revolutionise many industries, and particularly the manufacturing sector.
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ITW EAE has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines.
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Designed to prioritise clean air in the electronics manufacturing industry, the ZeroSmog Shield Pro sets a new standard for workplace health and safety.
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The D-VIS and DL-VIS from GKG SMT printer specialists are high-speed dispensing systems that can handle multiple scenarios.
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The Xpection 1860 from Scienscope is a versatile X-ray inspection machine that offers comprehensive circuit board defect detection and quality assurance for the SMT industry.
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Yamaha Robotics SMT section has revealed performance-boosting upgrades for the YRi-V 3D AOI system, including faster board handling, multi-component alignment checking, and enhanced LED coplanarity measurement.
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New LEXAN CXT film from SABIC offers high thermal process stability and transparency for demanding printed electronics substrates.
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Indium8.9HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloys.
Read more...Analog Devices and Mouser collaborate on eBook
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Mouser has released a new eBook in collaboration with Analog Devices, that offers a detailed analysis of the technologies being used to support sustainable manufacturing practices.
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On-the-fly marking at high speeds is only one of the comprehensive features of Panasonic’s new LP-RH laser marker series.
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