NXP Semiconductors’ new LPC1800 is an ARM Cortex-M3 microcontroller optimised for low-power operation at very low frequencies all the way through to 150 MHz maximum performance from either Flash or RAM. The flexible dual-bank 256-bit wide Flash memories can be used for concurrent write/read operations, allowing ‘golden copy’ preservation and prevention of reprogramming mishaps, or simply used as a single bank of memory. The LPC1800 also features a flexible quad-SPI interface and a state configurable timer subsystem. High-speed interfacing from quad-lane SPI memories at up to 80 Mbps per lane provides for much larger off-chip data and code execution than available from on-chip memories. The state configurable timer subsystem comprises a timer array with a state machine enabling complex functionality including event controlled PWM waveform generation, ADC synchronisation and dead time control.
Accelerate development of physical AI deployments Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...AI-ready edge MPU for HMIs Future Electronics
DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.
Read more...Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.
Read more...Universal NFC device Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...Compact low-power 32-bit platform EBV Electrolink
DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
Read more...Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.
Read more...Practical design strategies for 5G RF Design
Telecoms, Datacoms, Wireless, IoT
The Cavli CQM211 aims to provide a platform that combines strong 5G connectivity with onboard compute capability, as well as interface flexibility that suits both new designs and rapid migrations from earlier products.
Read more...Low-power memory born for edge AI iCorp Technologies
DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.