10 November 2010
Telecoms, Datacoms, Wireless, IoT
Texas Instruments introduced what it believes to be the industry’s first SuperSpeed USB (USB 3.0) transceiver, which is capable of much faster data transfers when compared to USB High-Speed devices (USB 2.0).
Featuring receiver sensitivity that is twice as good as required by the USB 3.0 specification, the TUSB1310’s PIPE3 and ULPI interfaces enable USB 3.0 functionality when used in conjunction with the integrated application processor digital cores. The 5 Gbps USB 3.0 physical layer transceiver operates from a single crystal or external reference clock with selectable frequencies from 20, 25, 30 and 40 MHz. The device is capable of completing data transfers of a 27 Gigabyte Blu-ray disc in less than 90 seconds, versus nearly 15 minutes with USB 2.0.
The TUSB1310 supports many applications, including surveillance cameras, multimedia handsets, smartphones, digital still cameras, portable media players, personal navigation devices, audio docks, video IP phones, wireless IP phones and software defined radios. TI’s portfolio of SuperSpeed USB devices also includes the SN65LVPE502, a dual-channel USB 3.0 redriver/equaliser; the TPD2EUSB30, a two-channel ESD solution for SuperSpeed USB 3.0 interface; and the TPS25xx series of USB power switches.
Accelerate development of physical AI deployments Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...Universal NFC device Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...Simplifying system design iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The FGMC63N tri-band MCU Wi-Fi 6E module from Quectel addresses offers integrated connectivity across 2,4 GHz, 5 GHz, and 6 GHz bands in a compact, highly optimised design.
Read more...Dragino’s connectivity catalogue Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Where Wi-Fi demands frequent charging and covers tens of meters, and traditional cellular consumes too much power for battery-operated nodes, LoRaWAN threads the needle.
Read more...RF filters explained RFiber Solutions
Telecoms, Datacoms, Wireless, IoT
As RF environments become increasingly crowded, RF filters play a critical role in maintaining signal quality, improving system performance, and ensuring reliable operation.
Read more...Practical design strategies for 5G RF Design
Telecoms, Datacoms, Wireless, IoT
The Cavli CQM211 aims to provide a platform that combines strong 5G connectivity with onboard compute capability, as well as interface flexibility that suits both new designs and rapid migrations from earlier products.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...SoC brings scalable edge AI to life Altron Arrow
AI & ML
The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.
Read more...An industry-first Android 16 smart module solution RF Design
Computer/Embedded Technology Telecoms, Datacoms, Wireless, IoT
The MeiG Smart SLM580 4G Smart Module features native support for Android 16 and covers core frequency bands in major countries and regions worldwide.
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