As DC-DC applications such as power modules, telecommunications and servers become more space-constrained, designers are looking for smaller devices to meet their design challenges. The thermal capability of these devices, however, is a concern.
In order to meet the needs for high current capability, high efficiency and smaller form factors, Fairchild Semiconductor developed the Dual Cool packaging for MOSFETs. The Dual Cool package is a top-side cooling PQFN device that incorporates new packaging technology which enables additional power dissipation through the top of the package.
Dual Cool packaging features an exposed heat slug that delivers a significant reduction in thermal resistance from junction to top of case, resulting in what Fairchild claims is more than 60% higher power dissipation capability than standard PQFN packaging when a heatsink is mounted. Additionally, MOSFETs in the Dual Cool package are designed with Fairchild’s proprietary PowerTrench process technology, which enables low RDS(ON) and high load currents in small package sizes.
These devices are currently available in both Power33 (3,3 x 3,3 mm) and Power56 (5 x 6 mm) packaging options. Maintaining the same industry-standard PQFN footprint, the Dual Cool package allows power engineers to rapidly qualify MOSFETs in Dual Cool packaging, gaining increased thermal efficiency without having to adjust for non-standard packages.
Devices currently available in the Dual Cool package include the FDMS-2504SDC, FDMS2506SDC, FDMS2508SDC, FDMS2510SDC (5 x 6 mm footprint) and the FDMC7660DC (3,3 x 3,3 mm footprint). These devices are targeted as synchronous rectifying MOSFETs for DC-DC converters, telecom secondary side rectification and high end server/workstation applications. MOSFETs in the Dual Cool package can be used with or without a heatsink.
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