Vishay has released two metal-core-based, cold white LED power modules, each assembled with 12, 24 or 36 high-brightness LEDs. The VLSL40xxA is designed for flexible use by utilising optional special reflectors to adjust the modules’ emission characteristics.
The VLSL50xxA features a clear silicone lens for a butterfly-shaped radiation characteristic.
Optimised for illumination in streetlights, internal building lighting, tunnel lights and general lighting applications, the VLSL40xxA and VLSL50xxA offer a colour temperature range of 5000 K to 7000 K. Both devices feature a shiny white surface and a metal-core, single-side PCB with a copper thickness > 0,75 μm. Each module includes a conductive top layer with a minimum Cu of 18 μm and a 63 μm prepreg 1080 FR4 type isolation layer.
The VLSL40xxA is available with the VLSL-REFL01 reflector, which is composed of an Al-alloy material with a non-high-polished surface. By using different reflector combinations, the emission in one direction can be adjusted in a typical range of 120° to 55°. The clear silicone lens of the VLSL50xxA allows for a ±35° vertical and ±60° horizontal angle of half intensity.
The VLSL40xxA and VLSL50xxA are based on InGaN technology and provide a maximum current of 700 mA. The LED modules feature standard solder mask material, and they offer luminous flux and colour binning. The devices provide ESD withstand voltage up to 2 kV in accordance with JESD22-A114-B and comply with ROHS 2002/95/EC.
General-purpose MCU with RISC-V architecture EBV Electrolink
DSP, Micros & Memory
Renesas has released a general-purpose MCU to enhance its existing RISC-V portfolio, and this is its first MCU using a RISC-V core developed internally at the company.
Read more...AI-native IoT platform launched EBV Electrolink
AI & ML
These highly-integrated Linux and Android SoCs from Synaptics are optimised for consumer, enterprise, and industrial applications and deliver an ‘out-of-the-box’ edge AI experience.
Read more...Serial SRAM up to 4 MB EBV Electrolink
DSP, Micros & Memory
The chips are designed to provide a lower-cost alternative to traditional parallel SRAM products, and include optional battery backup switchover circuitry in the SRAM memory to retain data on power loss.
Read more...Microchip expands its mSiC solutions EBV Electrolink
Power Electronics / Power Management
The highly integrated 3,3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration.
Read more...Powering up the intelligent edge EBV Electrolink
DSP, Micros & Memory
STMicroelectronics is releasing new devices from the second generation of its industrial microprocessors (MPUs), the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
Read more...Mouser broadens its LED lineup
Opto-Electronics
Mouser has broadened its LED lineup with diverse solutions designed to support lighting, medical, and smart home applications.
Read more...Flash for AI EBV Electrolink
AI & ML
SCM offers a midway latency point between DRAM and SSDs, and when coupled with the introduction of CXL, low-latency flash, such as XL-FLASH, is well-positioned to deliver improvements in price, system performance, and power consumption to everything from servers to edge devices deploying the power of AI.
Read more...UFS Ver. 4.0 embedded Flash memory devices EBV Electrolink
Computer/Embedded Technology
KIOXIA Europe has announced sampling of the industry’s first Universal Flash Storage (UFS) version 4.0 embedded Flash memory devices designed for automotive applications.
Read more...InnoSwitch5 Offline Flyback Switcher IC EBV Electrolink
Power Electronics / Power Management
ero-voltage switching (ZVS) flyback topology and advanced SR FET control enable 95% efficiency, together with reduced power supply size and component count.
Read more...IGBT power module EBV Electrolink
Power Electronics / Power Management
The company has now released its new half-bridge IGBT power modules offered in its redesigned INT-A-PAK package.
printer friendly version