Aries Electronics now offers machined high-frequency centre probe test sockets to accommodate IC devices with a lead pitch of 0,30 mm. With very low inductance and capacitance, the sockets are suitable for a wide variety of BGA (ball grid array), CSP (chip scale package) and MLF (micro land frame) packages.
Reduced inductance, increased board density and finer pitch array packages are made possible thanks to a four-point crown or sharp point gold plated 0,30 mm pitch probe pin, spring and flanged bottom pin, which contacts the tail of the probe pin to shorten the signal path. A signal path of just 1,96 mm allows for minimal signal loss and higher bandwidth capacity with the new machined high-frequency sockets.
The solderless pressure mount spring probes allow easy mounting of the socket to a test board and device solder ball or pad, while socket locating posts ensure accurate positioning of the socket to the board. The sockets are equipped with chip guides to allow exact device location and four-point edge male contacts for precise mating of the device. The socket’s small footprint ensures maximum use of the test board area for increased efficiency. Spring loaded contacts, made of gold-plated beryllium copper, provide a high lifetime of up to 500 000 cycles. Socket body material is Torlon PAI and all hardware is stainless steel.
The socket’s contact forces are 15 g per contact on a 0,30 mm to 0,35 mm pitch, 16 g per contact on a 0,40 mm to 0,45 mm pitch and 25 g per contact on a 0,50 mm pitch or larger. Contact resistance is less than 40 milliohms. Probe self-inductance on the new socket is 0,51 nH for large probes and 0,59 nH for small probes. The socket accepts solder ball sizes from 0,15 mm to 0,93 mm. Insertion loss is 1 dB to 10,1 GHz for a larger probe at 0,80 mm pitch and 1 dB to 18,7 GHz for a smaller probe at 0,50 mm pitch.
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