NXP develops new leadless 2-pin package

Electronics Technology

16 February 2011 Electronics Technology

NXP Semiconductors recently announced the availability of SOD882D, the industry’s first leadless package with solderable, tin-plated side pads. The SOD882D is a 2-pin plastic package measuring only 1 x 0,6 mm and is ideal for small and thin devices. With a height of only 0,37 mm, it is also one of the flattest packages in the 1006-size and is available in various ESD protection and switching diodes.

The new package has two tin-plated, solderable bottom pads that are exposed and are also Sn-plated on the sides. This innovative pad design provides soldering of the bottom and side pads and allows for easy visual inspection. The new package enables mechanically robust designs as it is optimised for maximum shear forces and board bending, and reduces the package tilting angle. The thermal, electrical, mounting and footprint characteristics of SOD882D are fully com-patible with other available 2-pin, leadless 1006-packages.

The first products to be available in the SOD882D package are a 100 V single high-speed switching diode (BAS16LD) and three 5 V and 24 V ESD protection diodes (PESD*LD) that are designed to protect one signal line up to 30 kV (IEC 61000-4-2; level 4). All products are AEC-Q101 qualified and values for line capacitance range between 23 and 152 pF. Two 5 V ESD protection diodes with only 1,05 pF and 11 pF (typical) will also be launched shortly. The portfolio will also include Schottky and low-capacitance ESD protection diodes. The SOD882D is free of halogens and antimony oxides and complies with non-flammability classification UL 94V-O and RoHS standards.

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NXP develops new leadless 2-pin package

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