Aries Electronics now offers a line of adapters which convert TSSOP, QFP and other fine-pitch devices to any other fine-pitch bumped package or routing configuration down to 0,4 mm pitch. The adapters are mounted to the existing PCB via raised pads up to 0,25 mm on the adapter bottom. They feature pads on the component side designed to accept any device on any pitch of 0,5 mm or greater.
In addition to simple circuit correction, other active or passive components can be added to the adapter to facilitate a more complex or custom adaptation via the open space available at the top of the adapter board. The adapter boards are 0,813 mm thick FR-4 or Rogers 370HR, with »-oz. copper traces on both sides. The non-solder mask defined pads are finished with electroless nickel immersion gold. The adapters can operate up to 105°C for FR-4 and 130°C for lead-free. They are available on tape-and-reel for high-speed SMT assembly and can be manufactured for RoHS compliance. Standard line and trace spacing down to 0,076 mm can be used.
Fine-pitch bump adapters are available in panelised form, as an adapter only or as a turnkey solution with devices mounted.
For more information contact Sivan Electronic Supplies, +27 (0)11 887 7879, [email protected]
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