Aries Electronics now offers a line of adapters which convert TSSOP, QFP and other fine-pitch devices to any other fine-pitch bumped package or routing configuration down to 0,4 mm pitch. The adapters are mounted to the existing PCB via raised pads up to 0,25 mm on the adapter bottom. They feature pads on the component side designed to accept any device on any pitch of 0,5 mm or greater.
In addition to simple circuit correction, other active or passive components can be added to the adapter to facilitate a more complex or custom adaptation via the open space available at the top of the adapter board. The adapter boards are 0,813 mm thick FR-4 or Rogers 370HR, with »-oz. copper traces on both sides. The non-solder mask defined pads are finished with electroless nickel immersion gold. The adapters can operate up to 105°C for FR-4 and 130°C for lead-free. They are available on tape-and-reel for high-speed SMT assembly and can be manufactured for RoHS compliance. Standard line and trace spacing down to 0,076 mm can be used.
Fine-pitch bump adapters are available in panelised form, as an adapter only or as a turnkey solution with devices mounted.
For more information contact Sivan Electronic Supplies, +27 (0)11 887 7879, elecsupp@global.co.za
Magnetic connectors with 2,54 mm pitch Spectrum Concepts
Interconnection
This expansion of the company’s Maxnetic product line delivers next-generation high reliability magnetic connectors designed for use in ever shrinking electronic devices and their applications.
Read more...Reliable connectivity in harsh environments Future Electronics
Interconnection
The ecomate family of circular, multiway connectors from Amphenol delivers exceptional durability, safety, and versatility for power and signal applications.
Read more...Cylindrical interconnects with multiple configurations Startech Industrial
Interconnection
Part of the renowned 5015 family of cylindrical interconnects, 97 Series connectors from Amphenol offer an exceptional range of customisation options to meet diverse connectivity needs across multiple industries.
Read more...Trunk line fusion splicer
Interconnection
The JILONG 280T All-Rounder Middle Trunk Line fusion splicer is a rugged, high-performance fibre optic fusion tool engineered for core networks, FTTx, and access infrastructure.
Read more...Low profile spring-loaded connectors Spectrum Concepts
Interconnection
Mill-Max has announced the introduction of low-profile, surface mount additions to its 2 mm pitch spring-loaded connector range.
Read more...Prefitted junction box solutions
Interconnection
Prepopulated junction boxes in popular terminal configurations, such as single- and three-phase, enhance convenience for both electrical wholesalers and contractors.
Read more...Bulgin unveils new range of sustainable connectors Avnet Abacus
Interconnection
The Standard Vitalis Buccaneer range of waterproof connectors is a bio-based alternative to Bulgin’s flagship series, the Standard Buccaneer, offering the same technical performance with improved sustainability.
Read more...Possible copper cable crisis looms as global demand soars
Interconnection
With the world requiring up to 3 billion metric tons of copper by 2050 to support green energy transitions and developing nations’ infrastructure, far exceeding the 23 million metric tons mined in 2024, pressure on supply chains is mounting.
Read more...High-reliability spring-loaded interconnects Spectrum Concepts
Interconnection
These springs from Mill-Max are drop-in replacements for the standard springs, requiring no changes to the form or fit of the existing spring-loaded pins.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version