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512 Mbit memory modules
27 April 2011, DSP, Micros & Memory

Winbond Electronics has introduced the latest offering of its mobile LPSDRAM products. With 65 nm ‘buried world line’ technology, there are four new devices of 512 Mb mobile LPSDRAM which extend the memory’s application beyond the mobile phone field to areas of mobile consumer electronics and mobile communication.

The W989D6C and W989D2C are 512 Mb devices which support x16/x32 data width. Major features include sequential or interleave burst;166 MHz clock rate; standard self refresh; partial-array self refresh (PASR); automatic temperature compensated self refresh rate (ATCSR); deep power-down (DPD); and programmable output buffer driver strength.

The W949D6C and W949D2C boast similar features, and add double data rate and a 200 MHz clock rate.


Credit(s)
Supplied By: KH Distributors
Tel: +27 11 854 5011
Fax: 086 694 8250
Email: sales@khd.co.za
www: www.khd.co.za
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Further reading:

  • Mixed-signal MCUs for digital power
    26 June 2019, EBV Electrolink, DSP, Micros & Memory
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    26 June 2019, iCorp Technologies, DSP, Micros & Memory
    The new W71NW20KK1KW from Winbond, which combines robust single level cell (SLC) NAND Flash and high-speed, low-power LPDDR4x memory, provides sufficient memory capacity for 5G cellular modems that are ...
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  • MCUs for touch-free UI
    30 April 2019, Hi-Q Electronics, DSP, Micros & Memory
    Renesas Electronics introduced two touch-free user interface (UI) solutions to simplify the design of 2D and 3D control-based applications. Based on the company’s capacitive sensor microcontrollers (MCUs), ...
  • MCUs with water-tolerant touch integration
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    27 March 2019, Hi-Q Electronics, DSP, Micros & Memory
    Renesas Electronics’ new highly integrated S5D3 MCUs (microcontrollers) simplify application development with their secure cryptographic engine and Synergy software package. Equipped with advanced security, ...

 
 
         
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