Laird Technologies has developed a new rigid corner board-level shield (BLS) that optimises component rigidity for increased part and printed circuit board (PCB) firmness.
As PCB designers are increasingly using thinner substrates, a rigid frame reinforces the assembly, thereby improving overall ruggedness and performance. The shield has improved solder joint reliability and resistance to solder joint fracture, especially in drop testing performance with thin PCBs.
Several standard Laird Technologies EMI style parts including single-piece, two-piece and multicompartmental board-level shields now use this new rigid corner design, along with availability in custom sizes. The new shield is stronger and more robust than traditional drawn shields, which results in coplanarity improvement of the solder castellations. The shield can tolerate high deflection without plastic deformation. Elimination of a drawn flange reduces the space needed on the PCB for shielding trace width by potentially ~0,3 mm, allowing for the shield to be more closely placed on the PCB. Elimination of draft allows for more under-shield space and improved component clearance.
The partially drawn corner is located near the top portion of the shield, resulting in improved torsional rigidity with no drawn lip and no draft. For parts over 2 mm, the corner is both drawn and formed with an interlocking multiradius corner, which provides enhanced EMI shielding effectiveness. The interlocking corner can be meshed and closed in during the forming and drawing process for additional improved rigidity for parts taller than 2 mm. For parts under 2 mm, the entire corner is drawn without an interlocking corner.
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