Circuit & System Protection


Thermal gap filler

11 May 2011 Circuit & System Protection

Laird Technologies has expanded its thermal gap filler product line with the release of its Tputty 506 series silicone putty. Specifically designed for high-wattage electronic applications, including automotive components, it is a soft, single-part thermal gap filler in which no cure is required. With a thermal conductivity of 3,5 W/m-K, it is ideal for situations involving large gap tolerances and in instances where traditional gap filler pads cannot be applied due to low pressure tolerances of the affected parts.

The silicone putty material transfers little to no pressure between interfaces. Because it is more viscous than grease, bleed and pump-out usually associated with grease is eliminated. Highly conformable and reworkable, Tputty 506 is coloured for automatic detection systems and is available in 75 cc, 180 cc, 360 cc and 600 cc cartridges, as well as 20 kg buckets.



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