NPL defect of the month

11 May 2011 Manufacturing / Production Technology, Hardware & Services

The accompanying optical image shows a side view of a chip scale package (CSP) with open joints – the gold pads have not been wetted during reflow soldering. Close examination shows the process to not be in control with poor solder paste printing leading to pads not covered with paste. The solder paste was found hanging up in the stencil apertures during process review. With no paste there would also not be any flux medium to aid reflow in an air environment.

It is possible, if the balls, pad and a nitrogen environment were being used, that reflow and wetting may have occurred, masking the root cause. The problem is related to poor printing, which may be caused by the design of the pad or stencil, poor printing parameters or blocked stencil apertures. The process needs to be reviewed and corrective action put in place; in-process inspection and training may also be beneficial.

This month’s defect video considers the problem of pad cratering. As always, it can be viewed at www.dataweek.co.za/video

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