NPL defect of the month

11 May 2011 Manufacturing / Production Technology, Hardware & Services

The accompanying optical image shows a side view of a chip scale package (CSP) with open joints – the gold pads have not been wetted during reflow soldering. Close examination shows the process to not be in control with poor solder paste printing leading to pads not covered with paste. The solder paste was found hanging up in the stencil apertures during process review. With no paste there would also not be any flux medium to aid reflow in an air environment.

It is possible, if the balls, pad and a nitrogen environment were being used, that reflow and wetting may have occurred, masking the root cause. The problem is related to poor printing, which may be caused by the design of the pad or stencil, poor printing parameters or blocked stencil apertures. The process needs to be reviewed and corrective action put in place; in-process inspection and training may also be beneficial.

This month’s defect video considers the problem of pad cratering. As always, it can be viewed at www.dataweek.co.za/video

Further reading:

Advanced X-ray inspection systems
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
The Scienscope AXl-6100 series comprises specialised X-ray inspection systems explicitly engineered for the examination of long circuit boards.

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Compact all-in-one placement machines
Testerion Manufacturing / Production Technology, Hardware & Services
Introducing the CLT-FG, a new series of compact all-in-one SMT placement machines

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200 W of power in a space-saving design
Vepac Electronics Manufacturing / Production Technology, Hardware & Services
The Hakko FX-972 Soldering Station delivers high-performance soldering in a compact package, making it suitable for a wide range of soldering applications.

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FineX: Makes shielding clear
Avnet Abacus Manufacturing / Production Technology, Hardware & Services
Panasonic Industry launches high-transparency, low-resistance, flexible transparent conductive film for electromagnetic wave shield with pre-applied OCA.

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Collaboration is now critical
RS South Africa Manufacturing / Production Technology, Hardware & Services
The message emerging from RS Connect is clear: Organisations can no longer rely on internal optimisation alone to secure performance. Competitive advantage is increasingly being determined by the strength of external relationships, shared capability and coordinated action across value chains.

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Disruption is the new normal. Effortless is the new competitive advantage.
Seven Labs Technology Manufacturing / Production Technology, Hardware & Services
Global supply chains have been under pressure for years. The manufacturers still standing are the ones who stopped waiting for normal to return, and started building something better.

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World-first 016008 mm component placement
Manufacturing / Production Technology, Hardware & Services
Fuji has achieved the world’s first placement of 016008 mm (0,16 x 0,08 mm or 006 x 003 inches) size components on printed circuit boards with its SMT pick and place machine, NXTR.

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Lifecycle and obsolescence: Protecting electronics through process
Production Logix Manufacturing / Production Technology, Hardware & Services
At Production Logix, we believe longevity is not accidental. It is engineered through early visibility, structured response, and disciplined execution, in partnership with our OEM customers.

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Maximising squeegee quality and durability
Testerion Manufacturing / Production Technology, Hardware & Services
Transition Automation has announced two new product advancements designed to improve SMT printing performance and extend squeegee life: laser-enhanced Permalex bonding and integrated edge protectors.

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NeoDen ND2 PCB screen printer
ZETECH ONE Manufacturing / Production Technology, Hardware & Services
The NeoDen ND2 PCB screen printing machine is a fully automatic stencil printer designed to deliver precise and consistent solder paste application in modern SMT production environments.

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