DSP, Micros & Memory


Touch sensing for MSP430 MCUs

22 June 2011 DSP, Micros & Memory

Texas Instruments has bestowed new touch sense capabilities upon its MSP430 range of 16-bit microcontrollers. The company’s capacitive touch portfolio introduces new hardware and free software solutions that give developers cost-effective options for microcontroller-based capacitive touch applications, while still benefitting from the battery-saving features of MSP430 devices.

The royalty-free MSP430 capacitive touch library gives developers the option to add touch sense capabilities to any MSP430 microcontroller. The open source software library eliminates the need to develop complex touch sensing algorithms and supports various capacitive touch sensors, including buttons, sliders, wheels and proximity.

Although the software library supports all MSP430 devices, some include new peripherals optimised specifically for touch sense applications. The MSP430 Value Line G2xx2 and G2xx3 devices include capacitive touch IOs, which enable developers to interface directly with capacitive touch pads without external components. Additionally, developers can look forward to upcoming MSP430F51x2 devices boasting Timer_D, a new high-resolution timer that enables high-precision touch sensing.

Rounding out the portfolio are TI’s easy-to-use kits, including the new Capacitive Touch BoosterPack, a plug-in for the MSP430 Value Line LaunchPad development tool, which allows for rapid evaluation and development of touch sensing applications. Additionally, the new MSP430F5529 experimenter board gives developers a highly-integrated evaluation platform to use touch sense buttons with a wide range of peripherals and sensors.

For more information contact EBV Electrolink, +27 (0)21 402 1940, capetown@ebv.com, www.ebv.com



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

KIOXIA pioneer new 3D Flash technology
EBV Electrolink DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.

Read more...
Ultra-wide signal capture from a single chip
RFiber Solutions DSP, Micros & Memory
Jariet Technologies developed Electra, a chipset that enables ultra-wide, multi-function and multi-band signal capture and generation from a single component.

Read more...
High-performance processing at the edge
Altron Arrow DSP, Micros & Memory
STMicroelectronics’ STM32MP23 microprocessor is designed to meet the demands of industrial, IoT, and edge AI applications.

Read more...
High-speed Flash for system-on-chip applications
NuVision Electronics DSP, Micros & Memory
GigaDevice unveiled the GD25NE series of dual-power supply SPI NOR Flash chips, designed specifically for 1,2 V SoC applications.

Read more...
Ultra-low-power Arm Cortex MCU with FPU
Altron Arrow DSP, Micros & Memory
STMicroelectronics expanded its STM32 ultra-low-power family with the launch of the STM32U3 for cost-sensitive applications in industrial, medical, and consumer electronics devices.

Read more...
Processor with attached NPU
Future Electronics DSP, Micros & Memory
STMicroelectronics expanded its STM32 ultra-low-power family with the launch of the STM32U3 for cost-sensitive applications in industrial, medical, and consumer electronics devices.

Read more...
Automotive Ethernet communications
EBV Electrolink News
EBV Elektronik has expanded its automotive solutions offering with Infineon’s Marvell Automotive Ethernet portfolio.

Read more...
Powering the future of embedded control
Altron Arrow Editor's Choice DSP, Micros & Memory
As the demand for intelligent, connected, and energy-efficient systems grows, embedded engineers are under pressure to design faster, smarter, and more secure products

Read more...
New RT PolarFire device qualifications
ASIC Design Services DSP, Micros & Memory
Microchip expands space-qualified FPGA portfolio with new RT PolarFire device qualifications and SoC availability.

Read more...
KIOXIA sampling UFS 4.1 embedded Flash
EBV Electrolink DSP, Micros & Memory
The new UFS devices use KIOXIA’s 8th-Gen BiCS FLASH 3D to boost speed and power efficiency.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved