Cypress Semiconductor and Redpine Signals have jointly developed 802.11a/b/g/n wireless connectivity solutions that make it possible for system engineers to add low-power, single-stream 802.11n Wi-Fi capability to embedded systems with Cypress’s PSoC 3 and PSoC 5 programmable system-on-chip platforms. These solutions are based on Redpine’s Connect-io-n modules that allow users to design new systems and upgrade existing products to provide reliable wireless data communications that meet stringent power and high throughput requirements.
With modular certification for FCC standards and equivalent certifications in other regions, these modules enable easy enhancement of PSoC 3- and PSoC 5-based designs with future-proof Wi-Fi 802.11n functionality. The Connect-io-n modules work seamlessly with Cypress’s PSoC platforms, which are used in a broad range of embedded system applications.
The Connect-io-n 802.11n modules are self-contained and system designers need not have a detailed knowledge of Wi-Fi technology to use them. The Redpine module products offer SPI and UART interfaces and provide wireless connectivity up to 10 Mbps on the SPI interface or up to 4 Mbps on the UART interface.
Redpine and Cypress have also collaborated to provide a Wi-Fi expansion board kit based on the Cypress PSoC 3 and PSoC 5 platforms. This kit (RS-CY8C001-220X) is an expansion board that seamlessly plugs into Cypress CY8CKIT-001 or CY8CKIT-030. The Wi-Fi Expansion Board Kit includes an 802.11n expansion board based on the Redpine Connect-io-n module and all necessary example projects and documentation.
Accelerate development of physical AI deployments Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...Universal NFC device Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...Simplifying system design iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The FGMC63N tri-band MCU Wi-Fi 6E module from Quectel addresses offers integrated connectivity across 2,4 GHz, 5 GHz, and 6 GHz bands in a compact, highly optimised design.
Read more...Dragino’s connectivity catalogue Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Where Wi-Fi demands frequent charging and covers tens of meters, and traditional cellular consumes too much power for battery-operated nodes, LoRaWAN threads the needle.
Read more...RF filters explained RFiber Solutions
Telecoms, Datacoms, Wireless, IoT
As RF environments become increasingly crowded, RF filters play a critical role in maintaining signal quality, improving system performance, and ensuring reliable operation.
Read more...Practical design strategies for 5G RF Design
Telecoms, Datacoms, Wireless, IoT
The Cavli CQM211 aims to provide a platform that combines strong 5G connectivity with onboard compute capability, as well as interface flexibility that suits both new designs and rapid migrations from earlier products.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...SoC brings scalable edge AI to life Altron Arrow
AI & ML
The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.
Read more...An industry-first Android 16 smart module solution RF Design
Computer/Embedded Technology Telecoms, Datacoms, Wireless, IoT
The MeiG Smart SLM580 4G Smart Module features native support for Android 16 and covers core frequency bands in major countries and regions worldwide.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version