ON Semiconductor released its newest product for integrated electrostatic discharge (ESD) protection. The ESD7004 is specifically designed to preserve signal integrity in high-speed applications such as USB 3.0 (5 Gbps) and eSATA (up to 6 Gbps). The device boasts an ultra low 0,4 pF capacitance rating, while maintaining very low ESD clamping voltage.
As high-speed interfaces exceed 5 Gbps, a few tenths of a picofarad capacitance can have a major effect on the signal integrity of the data being transmitted. By lowering the capacitance down to 0,4 pF typical (0,5 pF maximum) the ESD7004 offers an ESD protection solution that has virtually no effect on eye diagrams of USB 3.0 and eSATA. In addition, these parts maintain less than 1 dB insertion loss at over 8 GHz during S21 measurements, ensuring negligible effect on high-speed data transmission.
The device offers extremely low clamping voltages and fast response time during ESD events. It exhibits clamping voltages of 11,4 V or less during transmission line pulse (TLP) ±8 A testing which safeguards chipsets using small geometries and low-voltage tolerances, common for high-speed data lines. An ESD rating of 15 kV contact per the IEC61000-4-2 standard and low turn-on resistance during ESD events ensures that the most sensitive chipsets will be safe from ESD threats.
The ESD7004 is offered in the popular uDFN 2,5 x 1,0 x 0,5 mm 10-pin package which integrates four lines of protection in a flow-through routing pinout that enable board designers to route traces easily with minimal impact to impedance matching.
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