Available in all sizes from 06 to 40 poles, Microparts is offering IC sockets that come fitted with dual phosphorbronze tinned and passivated contacts. Terminations of the bonded version are completely sealed effectively preventing solder wicking. Terminals are available in either straight (standard) or formed for ease of retention in the PC board prior to soldering.
What’s the big deal with open pin fields? Spectrum Concepts
Interconnection
The concept behind the open pin field array is that it provides many contacts that are not limited to a single role.
Read more...New connector for Push-X technology Phoenix Contact
Interconnection
Phoenix Contact is extending the series of PCB connectors with innovative Push-X technology to include a new connector for conductor cross-sections up to 2,5 mm2.
Read more...Film and mica capacitors Actum Electronics
Passive Components
By utilising various polymer dielectrics plastics, Exxelia film and mica capacitors meet most technical requirements and serve all functions from standard filtering to specialised applications.
Read more...Test cable designed for maximum ruggedness Conical Technologies
Interconnection
The Anoison PT test cable is designed for maximum ruggedness using a high-quality raw cable, connector, and smart armouring module.
Read more...Safe connection under load Phoenix Contact
Interconnection
The ArcZero DC connectors from Phoenix Contact can be safely connected and disconnected under load, providing operators with reliable protection against hazardous electric arcs.
Read more...Time-To-Market interconnect solutions
Interconnection
TTM Technologies are at the forefront of electrified powertrains, vehicle charging stations, and energy storage solutions, providing thermal management, high-current capabilities, and specialised solutions.
Read more...Connectors for energy storage systems Phoenix Contact
Interconnection
The new Phoenix Contact BPC series connectors are protected against polarity reversal making them ideally suited for use in energy storage systems.
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