Clare recently announced what it says is the industry's first, single package data access arrangement (DAA) that includes an isolation barrier inside the chip. Clare's Litelink II DAA can replace bulky magnetic transformers and various other discrete components commonly found in traditional DAAs. The Litelink II DAA enables minimised board space, reduced product costs and a simplified manufacturing process in modem, set-top box and telephony applications.
This all-silicon DAA features 2,7 to 5,5 V operation for interfacing with popular modem and voice band CODEC chipsets. In addition, the solution offers a simple system for international compatibility with the PSTN. Clare's Litelink II has been successfully tested to UL1950, UL1459, UL1577, EN60950, FCC Part 68 and Part 15, and TBR-21.
The Litelink II places a 1500 VRMS isolation barrier between the line side and modem side ICs located inside the 32-pin SOIC package, eliminating the need for external optocouplers or high-voltage capacitors in the data path. It offers a broad feature set, including high-voltage isolation, proper AC and DC phone line terminations, 2-to-4 wire hybrid function, on-hook and off-hook detection, caller ID, and half wave ring detect circuitry.
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