Expanding its LaunchPad portfolio to the ARM ecosystem, Texas Instruments announced a new low-price, easy-to-use Stellaris LM4F120 LaunchPad evaluation kit. The tool allows professional engineers, hobbyists and university students to begin exploring ARM Cortex-M4F microcontrollers and TI’s Stellaris family of microcontrollers.
The core of the new LaunchPad is a Stellaris LM4F120 MCU which features low power, integrated analog and floating-point performance and lends itself to the highly flexible and modular design environment of the LaunchPad with abundant peripherals for real-time digital signal control.
The Stellaris LaunchPad brings consumer electronics, human interface control, health and fitness and many more applications to a wider audience of developers. The kit includes all the hardware and software needed to get started in 10 minutes or less.
The Stellaris LaunchPad uses the BoosterPack XL connection standard that consists of two pairs of dual-gender 20-pin stackable headers. Those 40 easy-to-access pins allow interface with external components (BoosterPacks) or custom daughter boards.
Two sets of 20 pins on the outer rows of the board have similar functions to the primary header pins on existing MSP430 and C2000 LaunchPad kits, allowing developers to add greater functionality and speed design and exploration. Two inner rows offer an additional 20 pins of Stellaris-based expansion signals for BoosterPack development.
The kit includes a 32-bit LM4F120H5QR Cortex-M4 MCU with floating-point operating up to 80 MHz that provides targeted performance headroom for application differentiation, 64 KB Flash with 100 000 write/erase cycles and two 12-bit 1 MSps ADCs and up to 27 timers, some configurable up to 64 bits.
Licence- and royalty-free StellarisWare software is pre-loaded in ROM to conserve Flash memory. The kit incorporates USB connectivity and other peripherals including serial ports for UART, I²C, SSI/SPI and CAN controllers so developers can support the communication standard best suited for their application.
An out-of-the-box RGB LED example application lets developers start experimenting with the Stellaris LaunchPad in minutes. Planned BoosterPacks include capabilities for sensors, wireless connectivity and many more third-party BoosterPacks.
Advanced pressure monitoring sensor EBV Electrolink
Test & Measurement
The Infineon KP497 is an advanced, highly integrated digital pressure sensor designed for demanding automotive and industrial applications, with a particular focus on battery management systems.
Read more...Quad-Apollo MxFE reference design
Design Automation
The Quad-Apollo MxFE reference design exemplifies a complete, high-performance platform for every-element direct-RF sampling digital beamforming using Analog Devices’ Apollo mixed-signal front-end technology.
Read more...High-efficiency 600 V power MOSFET EBV Electrolink
Power Electronics / Power Management
The Infineon Technologies 600 V CoolMOS CFD7 is a high-voltage, super-junction N-channel MOSFET technology designed to deliver outstanding efficiency and robust switching performance.
Read more...High-performance FPGA family EBV Electrolink
DSP, Micros & Memory
AMD’s Kintex UltraScale+ FPGA family delivers high-performance, mid-range field programmable gate arrays that balance price, performance, and power efficiency for demanding DSP applications.
Read more...MIKROE signs multi-year deal with Renesas Dizzy Enterprises
Design Automation
MIKROE has signed a multi-year MCU development tool support deal with Renesas, which commits MIKROE to providing development tools for 500 of Renesas’ most popular MCUs.
Read more...Pulsonix 14.0 advances design
Design Automation
Pulsonix’s latest PCB design software platform further strengthens simulation and brings significant enhancements in mechanical-electrical 3D integration, smarter comparison tools, and enhanced usability features.
Read more...KIOXIA pioneer new 3D Flash technology EBV Electrolink
DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version