Texas Instruments announced that its Bluetooth v4.0 technology-based CC2560 and CC2564 wireless devices are now available in easy-to-integrate QFN packages. The company also announced the availability of additional production-ready modules based on the two devices, as well as software and tools.
The ROHS-compliant QFN packages of the CC2560 and CC2564 Bluetooth v4.0 devices are available together with a downloadable two-layer reference design (schematics, layout and bill of materials) that can be copied and pasted into end applications.
The CC2560 device offers Bluetooth v4.0 ‘classic’ support for audio and data applications requiring high throughput. The CC2564 device supports two options: dual-mode Bluetooth/Bluetooth low energy or dual-mode Bluetooth/ANT+.
Applications that benefit from the dual-mode solution include those that require wireless communication to Bluetooth ‘classic’ products and Bluetooth low energy or ANT+ devices such as sports and fitness aggregator gadgets or smart watches. The dual-mode Blue-tooth v4.0 solution can also be used as a sensor solution that delivers longer range to communicate with mobile devices that may or may not have Bluetooth low energy technology.
In addition to the two modules previously announced, four new complete, validated and certified modules are now available. The modules vary in size, temperature range and output power, and include Class 1 and Class 2 versions. One module also offers a pre-integrated MCU plus CC2564 solution for faster development.
Software development kits for Bluetooth and Bluetooth/Bluetooth low energy solutions are currently available. Customers can also access sample applications and demos provided in source code showing API usage. A royalty-free Bluetooth stack and various profiles are provided pre-integrated on MCUs such as TI’s ultra-low power MSP430 MCU and Stellaris ARM Cortex-M3/M4 MCUs.
TI will also release an updated Bluetooth stack near the end of 2012. The new stack will reportedly offer flexible software build options that will enable customers to select specific profiles to support. This capability allows for greater memory size optimisation and the ability to support a broader range of MCUs.
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