Agilent Technologies announced shipment of Advanced Design System 2012, its flagship RF and microwave EDA software platform. ADS 2012 features new capabilities that improve productivity and efficiency for all applications the system supports and breakthrough technologies applicable to GaAs, GaN and silicon RF power-amplifier multichip module design.
User interface enhancements improve design efficiency and productivity, such as dockable windows for quickly accessing frequently used dialog boxes. Updated load pull and amplifier design guides offer mismatch simulation and make it easy to see amplifier performance at a specific output power level or a specific amount of gain, respectively.
Dramatically improved integration with EMPro enables 3D electromagnetic component designs to be saved as database cells for use directly in ADS. A new ADS electro-thermal simulator incorporates dynamic temperature effects to improve accuracy in ‘thermally aware’ circuit simulation results.
Multichip module electromagnetic simulation setup and Finite Element Method simulation of different technologies allows users to analyse electromagnetic interactions between circuits and interconnects, wire bond and flip-chip solder bumps in typical multichip RF power amplifier modules.
New model support for Agilent’s artificial neural network-based NeuroFET model (extracted by Agilent’s IC-CAP device modelling software) enables more accurate FET modelling and simulation results.
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