Computer/Embedded Technology


Pico-ITX board

20 March 2013 Computer/Embedded Technology

Based on the ultra-compact Pico-ITX form factor measuring only 10 x 7,2 cm, the VIA EPIA-P900 combines a 1,0 GHz Eden X2 CPU and the latest VIA VX900H MSP.

The board supports up to 4 GB of DDR3 memory, HD audio, HDMI, VGA and LVDS display connectivity, as well as a high-performance hardware HD video decoder in the shape of the latest VIA ChromotionHD 2.0 video engine.

The ChromotionHD 2.0 engine provides advanced filtering and post-processing to perform ultra smooth decoding of H.264, MPEG-2, VC-1, WMV9 and HDCP for Blu-ray content protection, providing smooth playback of the most demanding multimedia titles at resolutions up to 1080p without incurring a heavy CPU load.

The VIA EPIA-P900 features the VIA Vinyl VT2021, a 10-channel HD audio codec, delivering advanced sound quality and support for Blu-ray and HD DVD audio content protection.

Onboard pin headers provide support for an additional five USB 2.0 ports, an LPC connector, SMBus connector, PS/2 support, audio jacks, LVDS, four pairs of DIO and two UART ports. Rear I/O includes one HDMI port, one VGA port, two USB 2.0 ports and a GigaLAN port.

For more information visit www.via.com.tw





Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Embedded software development
Computer/Embedded Technology
The reliance on C is being reduced, with Python the language of choice for embedded applications in the fields of IoT and AI.

Read more...
Microsoft Windows IoT on ARM
Altron Arrow Computer/Embedded Technology
This expansion means that the Windows IoT ecosystem can now harness the power of ARM processors, known for their energy efficiency and versatility.

Read more...
Hardened-grade network switches
CST Electronics Computer/Embedded Technology
Lantronix’s hardened switches provide Layer 2 or Layer 3 networking, and are available as Power-over-Ethernet (PoE) or Power-over-Ethernet Plus (PoE+).

Read more...
Switched mezzanine card for enhanced Ethernet connectivity
Rugged Interconnect Technologies Computer/Embedded Technology
The TXMC897 sets a new standard in high-speed Ethernet communication, with advanced features and flexibility.

Read more...
Ryzen V3000 computer on module
Altron Arrow Computer/Embedded Technology
SolidRun has recently announced the launch of its new Ryzen V3000 CX7 Com module, configurable with the eight-core/16-thread Ryzen Embedded V3C48 processor.

Read more...
1.6T Ethernet IP solution to drive AI and hyperscale data centre chips
Computer/Embedded Technology
As artificial intelligence (AI) workloads continue to grow exponentially, and hyperscale data centres become the backbone of our digital infrastructure, the need for faster and more efficient communication technologies becomes imperative. 1.6T Ethernet will rapidly be replacing 400G and 800G Ethernet as the backbone of hyperscale data centres.

Read more...
Maximising edge computing
Computer/Embedded Technology
Senao Networks has announced its launch of its SX904 SmartNIC based on the Intel NetSec Accelerator Reference Design.

Read more...
Duxbury unveils next-gen solar-powered switches
Computer/Embedded Technology
These powerful solar-powered switches are ideal for any environment requiring reliable Power-over-Ethernet (PoE) capabilities.

Read more...
UFS Ver. 4.0 embedded Flash memory devices
EBV Electrolink Computer/Embedded Technology
KIOXIA Europe has announced sampling of the industry’s first Universal Flash Storage (UFS) version 4.0 embedded Flash memory devices designed for automotive applications.

Read more...
Powering factory automation into the future
Rugged Interconnect Technologies Computer/Embedded Technology
Powered by the newest 13th Gen Intel processors, ADLINK Technology’s COM-HPC-cRLS module is a future-proof edge AI solution.

Read more...