DSP, Micros & Memory


High-speed SRAMs

24 July 2013 DSP, Micros & Memory

Alliance Memory has expanded its line of legacy high-speed CMOS SRAMs with two new 16 Mb ICs. Featuring fast access times of 10 ns, the AS7C316096A (2048K x 8) and AS7C316098A (1024K x 16) are both offered in the 48-pin, 12 by 20 mm TSOP-1 package. In addition, the AS7C316098A is available in the 48-ball, 6 by 8 mm TFBGA package.

The devices provide reliable drop-in, pin-for-pin-compatible replacements for a number of similar solutions in communications, industrial, automotive and medical applications requiring fast access times. They provide low power consumption with operating currents of 90 mA typical and standby currents of 4 mA typical. They operate from a single power supply of 3,3 V, and all inputs and outputs are fully TTL-compatible.

The SRAMs are fabricated using very high-performance, high-reliability CMOS technology, and their current is stable within the operating temperature range of -40°C to +85°C. They offer fully static operation and tri-state output, and feature a data retention voltage of 1,5 V minimum.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

ESP32-C6 achieves PSA-L2
iCorp Technologies DSP, Micros & Memory
Espressif Systems recently announced that its ESP32-C6 microcontroller has achieved PSA Certified Level 2 (PSA-L2) security certification, making it the first RISC-V-based MCU to reach this level.

Read more...
Microprocessor with integrated NPU
Avnet Silica DSP, Micros & Memory
The RZ/G3E from Renesas is a microprocessor integrated with quad CPU and NPU in one chip, improving power efficiency, reliability, and security.

Read more...
Nordic Semiconductor launches nRF Connect SDK Bare Metal option for nRF54L series
Avnet Silica DSP, Micros & Memory
This is a new, RTOS-independent software solution for Bluetooth LE development, designed to ease developers’ migration from the legacy nRF5 SDK and nRF52 series to the next-generation nRF54L series.

Read more...
Dual-core support in NECTO Studio
DSP, Micros & Memory
MIKROE recently announced that version 7.3.0 of its NECTO Studio Integrated Development Environment now supports dual-core MCUs, allowing designers to program and debug each core independently.

Read more...
Post Quantum Cryptographic firmware library
DSP, Micros & Memory
The STM32 post-quantum cryptographic library enables developers to satisfy application requirements for any combination of data integrity, confidentiality, identification/authentication, and nonrepudiation.

Read more...
MultiVolt series of oscillators
Future Electronics DSP, Micros & Memory
The ECS-3225MVQ from ECS Inc. is a compact, quartz-based MultiVolt oscillator designed for precision timing in automotive, industrial, and portable electronic systems.

Read more...
MCU platform for battery-powered devices
Altron Arrow DSP, Micros & Memory
The MCX W23 is a new dedicated wireless MCU platform from NXP for battery-powered sensing devices.

Read more...
Drive innovation with AURIX TriCore MCUs
Future Electronics DSP, Micros & Memory
Infineon’s AURIX TriCore family balances safety, performance, and energy efficiency to offer a scalable and future-ready portfolio.

Read more...
Elevate your motor control designs
EBV Electrolink DSP, Micros & Memory
Built on an Arm Cortex-M33 core running up to 180 MHz, the MCX A34 family combines high-performance math acceleration and advanced motor control subsystems to unlock efficient motor drive solutions.

Read more...
Embedded platform for compute-intensive applications
iCorp Technologies DSP, Micros & Memory
The Quectel QSM368ZP-WF is a fully featured embedded ARM platform optimised for compute-intensive industrial and IoT applications.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved