DDR3 DIMM memory sockets
18 September 2013
Interconnection
Molex has introduced a portfolio of aerodynamic DDR3 DIMM sockets and ultra-low profile DDR3 DIMM memory module sockets, both of which are ideal for demanding memory applications in telecommunication, networking and storage systems, advanced computing platforms, industrial controls and medical equipment.
The new sockets feature a lower seating plane than standard designs, enabling the use of very low-profile modules with maximum seating heights below 2,80 mm in ATCA blade systems. They also feature low-level contact resistance of 10 milliohms to support the use of registered DIMM modules and reduce power consumption in blade servers.
The aerodynamic DIMM sockets feature a streamlined housing and latch design to maximise airflow and eliminate trapped hot air during operation. The ergonomic latches enable quick actuation and easy removal of high-density memory modules. The low 2,40 mm seating plane optimises vertical space for more flexible socket module design heights.
Aerodynamic DDR3 DIMM sockets are available in very low profile press-fit (14,26 mm), low profile press-fit (22,03 mm), low profile SMT (21,34 mm) and very low profile SMT (14,20 mm) heights. The press-fit sockets feature smaller eye-of-needle compliant pins than standard press-fit terminals to free up valuable PCB real estate for higher-density trace routing. All Molex aerodynamic DDR3 DIMM sockets are RoHS compliant and SMT versions are halogen-free.
Molex ultra-low profile DDR3 DIMM sockets feature a seating plane of only 1,10 mm. The sockets provide up to 20,23 mm of vertical space above the PCB for mounting high-density DIMMs and are ideal for applications requiring conformance to ATCA board mechanics specifications where component heights cannot exceed 21,33 mm from side one of the front board PCB.
The ultra-low profile DDR3 DIMM sockets also feature reduced latch-actuation angles, which use less PCB real estate than standard DIMM sockets to improve airflow and enable more adjacent components. The new halogen-free sockets have a glass-filled, high-temperature nylon housing and latches to enable wave soldering and high-temperature infrared reflow operations.
For more information contact Craig Gibbs, Avnet Kopp, +27 (0)11 319 8600, [email protected], www.avnet.co.za.
Further reading:
Digital link 40x faster than broadband Internet
Hiconnex
Interconnection
Axon’s AxoMach high-speed links were recently qualified by the European Space Agency to the ESCC 3409/001 standard, and are designed to transmit data at speeds of up to 40 Gbps for space applications.
Read more...
Modular CAT7 inter-car-connection
Hiconnex
Interconnection
These modular connectors are particularly suitable for harsh environments, and have a high resistance to industrial vibration and an IP67 protection rating.
Read more...
Multi-channel cable assembly
RFiber Solutions
Interconnection
Withwave’s Multi-Channel SMPM Cable Assemblies (WMCM Series) provide a wide range of multiple coax connectors and flexible cable assemblies, with a choice of 26,5, 40 and 50 GHz configurations.
Read more...
Compact power relays
Future Electronics
Interconnection
The new HE-R Series power relays by Panasonic Industry are PCB-mounted relays for easy board assembly, with both two- and four-pole contact arrangement options.
Read more...
High-density multicoax cable assembly
RFiber Solutions
Interconnection
Withwave’s high speed and high-density Multicoax Cable Assemblies (WMX Series) provide a wide range of multiple coax connectors and flexible cable assemblies with a choice of
20, 40, 50, 67 or 110 GHz configurations.
Read more...
Centralised distribution for M8 and M12 connectors
Communica
Interconnection
Amphenol LTW’s distribution boxes facilitate efficient cable management, easy installation with pre-wired configuration, and provide a centralised distribution point for M8 and M12 connectors.
Read more...
What is an RF connector?
Spectrum Concepts
Editor's Choice Interconnection
If you look across the broader electromagnetic spectrum, the selection of the 3 kHz to 300 GHz frequency range for RF signals is a result of a balance between propagation characteristics, data transmission requirements, regulatory allocations, and the compatibility of electronic components and devices.
Read more...
Multi-head battery contacting solutions
Electronic Industry Supplies
Interconnection
INGUN has developed contacting solutions which boast low contact resistances, maximum reduced power losses, and stable, durable electrical connections in either single- or multi-head contacting configurations.
Read more...
Expanded magnetic connector lineup
Spectrum Concepts
Interconnection
Mill-Max has expanded its Maxnetic lineup to offer more options for connections and terminations, including board-to-board, cable-to-board, and cable-to-cable choices.
Read more...
Robust M12 high-temperature connector
Communica
Interconnection
Amphenol LTW has released its newest connector, the HDM12, a robust M12 high-temperature offering engineered for commercial applications.
Read more...
printer friendly version