High-density edge card socket

13 November 2013 Interconnection

Samtec’s line of high-speed edge card solutions now includes a new high-density socket (BEC5C series) featuring up to 140 total contacts on 0,50 mm pitch. The dual beam bi-level contact system is on a staggered 0,5 mm pitch, which reduces card mating force without reducing reliability.

This vertical socket is available for both 1,60 mm and 2,36 mm card thicknesses. Standard features include a lower-cost phosphor bronze contact, weld tabs, alignment pins and lead-free solder crimp terminations for easy board processing. Tin-lead solder charges, as well as alternative platings and pin counts, are also available.

For more information contact Craig Gibbs, Avnet Kopp, +27 (0)11 319 8600, [email protected], www.avnet.co.za

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