29 January 2014Manufacturing / Production Technology, Hardware & Services
Nordson YESTECH’s new high-speed FX SL AOI inspection system for populated printed circuit boards offers high-speed ‘capture on the fly’ inspection and utilises a flexible and comprehensive set of inspection tools, including angled cameras, a 3D height sensor, advanced lighting, full colour digital image processing technology and both image- and rule-based algorithms.
Configurable for all line positions, the FX series is equally effective for paste, pre-/post-reflow and final assembly inspection. Off-line programming maximises machine utilisation and real-time SPC monitoring provides a valuable yield enhancement solution.
With its advanced colour camera imaging technology, the system offers high-speed PCB inspection with exceptional defect coverage. With one top-down viewing camera and four side-viewing cameras, the FX SL inspects solder joints and verifies correct part assembly, enabling users to improve quality and increase throughput.
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