Texas Instruments has introduced the industry’s first pair of 10 Gbps serial link aggregator ICs.
The TLK10081 1- to 8-channel and TLK10022 dual-channel ICs allow system designers to reduce the number of gigabit serial links required for communications, video, imaging and other end equipment. They aggregate and de-aggregate point-to-point serial data streams for transmission over backplanes, copper cables and optical links.
With these ICs, designers can avoid the costly and time consuming development of custom aggregator IP for high-performance FPGAs or ASICs. Both devices occupy a claimed 70% smaller footprint than FPGAs and use only two power rails, compared to the five or six rails needed with FPGAs.
The aggregators directly connect serial links from data converters and processors without having to re-format the data for transmission in applications like wireless infrastructure, switches, routers, video surveillance, machine vision, high-speed imaging and optical transport systems.
The TLK10081 can aggregate up to eight lanes of full-duplex, 1,25 Gbps data traffic onto a single 10 Gbps link for transmission over short-distance backplanes or copper cables up to 10 metres, or long-distance optical links. The TLK10022 supports 4:1, 3:1 and 2:1 bidirectional serial link configurations. Each device supports many different data types without requiring special data encoding.
Intelligent serial link switching enables programmable channel lane switching of serial links in different configurations without using external multiplexing. This feature reduces system implementation time while achieving fault tolerance goals. Advanced decision feedback equalisation (DFE) and feed forward equalisation (FFE) extends transmission distances over copper media and optical links.
Accelerate development of physical AI deployments Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...Universal NFC device Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...Simplifying system design iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The FGMC63N tri-band MCU Wi-Fi 6E module from Quectel addresses offers integrated connectivity across 2,4 GHz, 5 GHz, and 6 GHz bands in a compact, highly optimised design.
Read more...Dragino’s connectivity catalogue Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Where Wi-Fi demands frequent charging and covers tens of meters, and traditional cellular consumes too much power for battery-operated nodes, LoRaWAN threads the needle.
Read more...RF filters explained RFiber Solutions
Telecoms, Datacoms, Wireless, IoT
As RF environments become increasingly crowded, RF filters play a critical role in maintaining signal quality, improving system performance, and ensuring reliable operation.
Read more...Practical design strategies for 5G RF Design
Telecoms, Datacoms, Wireless, IoT
The Cavli CQM211 aims to provide a platform that combines strong 5G connectivity with onboard compute capability, as well as interface flexibility that suits both new designs and rapid migrations from earlier products.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...SoC brings scalable edge AI to life Altron Arrow
AI & ML
The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.
Read more...An industry-first Android 16 smart module solution RF Design
Computer/Embedded Technology Telecoms, Datacoms, Wireless, IoT
The MeiG Smart SLM580 4G Smart Module features native support for Android 16 and covers core frequency bands in major countries and regions worldwide.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version